Processing apparatus and processing method of stack

ABSTRACT

A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

TECHNICAL FIELD

The present invention relates to an object, a method, or a manufacturingmethod. In addition, the present invention relates to a process, amachine, manufacture, or a composition of matter. In particular, thepresent invention relates to, for example, a semiconductor device, adisplay device, a light-emitting device, a power storage device, aprocessing device, a driving method thereof, or a manufacturing methodthereof. In particular, one embodiment of the present invention relatesto a method for processing a stack or a stack processing apparatus.

BACKGROUND ART

In recent years, research and development have been extensivelyconducted on light-emitting elements utilizing electroluminescence (EL).As a basic structure of these light-emitting elements, a layercontaining a light-emitting substance is interposed between a pair ofelectrodes. Voltage is applied to this element to obtain light emissionfrom the light-emitting substance.

The above light-emitting element is a self-luminous element; thus, alight-emitting device using the light-emitting element has advantagessuch as high visibility no necessity of a backlight, and low powerconsumption. The light-emitting device using the light-emitting elementalso has advantages in that it can be manufactured to be thin andlightweight and has high response speed.

A light-emitting device including the above light-emitting element canhave flexibility; therefore, the use of the light-emitting device for aflexible substrate has been proposed.

As a method for manufacturing a light-emitting device using a flexiblesubstrate, a technology in which a separation layer is formed over asubstrate, e.g., a glass substrate or a quartz substrate, asemiconductor element such as a thin film transistor is formed over theseparation layer, and then, the semiconductor element is transferred toanother substrate (e.g., a flexible substrate) has been developed (seePatent Document 1).

REFERENCE Patent Document [Patent Document 1] Japanese Published PatentApplication No. 2003-174153 DISCLOSURE OF INVENTION

In the case of forming a light-emitting device or the like directly on aflexible substrate, the upper-limit temperature of a manufacturingprocess needs to be relatively low because a material for the flexiblesubstrate has low heat resistance. For this reason, the quality ofcomponents of the light-emitting device might be reduced. Furthermore,in the case where alignment is performed in the manufacturing process,expansion and contraction of the flexible substrate due to heating inthe manufacturing process might reduce yield.

For this reason, to reasonably perform various steps such as a heatingstep, an alignment step, and the like in a manufacturing process of alight-emitting device or the like using a flexible substrate, it ispreferable that the steps be performed on a rigid substrate such as aglass substrate with heat resistance, and the light-emitting device orthe like be transferred to the flexible substrate in the final stage ofthe manufacturing process.

In addition, depending on the kinds of light-emitting device or the likeusing a flexible substrate, the following manufacturing process can beused: thin components formed over two different rigid substrates areattached to each other, one of the rigid substrates is separated (firstseparation step) and a flexible substrate is attached, and the other ofthe rigid substrates is separated (second separation step) and aflexible substrate is attached. In this process, the first separationstep requires a technique with great difficulty for separating the rigidsubstrates attached to each other with an extremely narrow gap.

Furthermore, to carry out the second separation step with highreproducibility, an external force applied to the flexible substratesneeds to be adjusted with high accuracy. When the adjustment isinadequate, the component cannot be separated or the component is cutduring the separation in some cases.

In view of the above, an object of one embodiment of the presentinvention is to provide a stack processing apparatus that inserts awedge-shaped jig into a gap between two substrates attached to eachother. Another object is to provide a stack processing apparatus thatsenses a gap between two substrates attached to each other. Anotherobject is to provide a stack processing apparatus that separates one oftwo substrates attached to each other with a gap provided therebetweenfrom the other of thereof. Another object is to provide a stackprocessing apparatus that separates a stack including a component formedover a substrate and a flexible substrate. Another object is to providea stack processing apparatus that separates a stack including acomponent formed over a substrate and a flexible substrate with the useof jigs adsorbing part of the flexible substrate. Another object is toprovide a stack processing apparatus that separates a stack including acomponent formed over a substrate and a flexible substrate with the useof jigs adsorbing part of the flexible substrate and a jig clamping andfixing part of the flexible substrate. Another object is to provide astack processing apparatus in which one of two substrates attached toeach other with a gap provided therebetween is separated from the otherthereof, and a flexible substrate is attached to a remaining portion.Another object is to provide a stack processing apparatus in which oneof two substrates attached to each other with a gap providedtherebetween is separated from the other thereof to form a firstremaining portion, a first flexible substrate is attached to the firstremaining portion, the other of the substrates is separated to form asecond remaining portion, and a second flexible substrate is attached tothe second remaining portion. Another object is to provide a novel stackprocessing apparatus. Another object is to provide a novel manufacturingapparatus. The other object is to provide a method for processing astack with the use of any of the above stack processing apparatuses orthe manufacturing apparatus.

Note that the descriptions of these objects do not disturb the existenceof other objects. In one embodiment of the present invention, there isno need to achieve all the objects. Other objects will be apparent fromand can be derived from the description of the specification, thedrawings, the claims, and the like.

The present invention relates to a stack processing apparatus.

One embodiment of the present invention is a processing apparatus of astack including two substrates attached to each other with a gapprovided between their end portions. The processing apparatus of thestack includes a fixing mechanism that fixes part of the stack, aplurality of adsorption jigs that fix an outer peripheral edge of one ofthe substrates of the stack, and a wedge-shaped jig that is insertedinto a corner of the stack. The plurality of adsorption jigs include amechanism that allows the adsorption jigs to move, separately in avertical direction and a horizontal direction.

The processing apparatus of the stack preferably includes a sensorsensing the position of the gaps between the end portions in the stack.

A structure may be employed in which a tip of the wedge-shaped jig movesalong a chamfer formed on an end surface of the stack, and thewedge-shaped jig is inserted into the gap between the end portions inthe stack.

The processing apparatus of the stack preferably includes a nozzle forinjecting liquid to the stack.

The processing apparatus of the stack may include a roller in contactwith the one of the substrates of the stack.

Another embodiment of the present invention is a processing apparatus ofa stack including a flexible substrate. The processing apparatus of thestack includes a fixing mechanism that fixes part of the stack, aplurality of adsorption jigs that fix an outer peripheral edge of theflexible substrate, and a plurality of clamp jigs that fix part of theflexible substrate of the stack. The plurality of adsorption jigs andthe plurality of clamp jigs each include a mechanism that allows theplurality of adsorption jigs or the plurality of clamp jigs to moveseparately in a vertical direction and a horizontal direction.

The processing apparatus of the stack preferably includes a nozzle forinjecting liquid to the stack.

It is preferable that the plurality of clamp jigs include a first clampjig and a second clamp jig, and the first clamp jig and the second clampjig each include a mechanism that allows a movement in a direction inwhich the fixed flexible substrate is expanded.

Another embodiment of the present invention is a processing apparatus ofa first stack including two substrates attached to each other with gapsprovided between their end portions. The processing apparatus includes aloader unit that feeds the first stack, a support feeding unit thatfeeds a support, a separating unit that separates one of the substratesof the first stack to form a remaining portion, an attaching unit thatattaches the support to the remaining portion with the use of anadhesive layer, and an unloader unit that transports a second stackincluding the remaining portion and the support attached to each otherwith the adhesive layer. The separating unit includes a fixing mechanismthat fixes part of the first stack, a plurality of adsorption jigs thatfix an outer peripheral edge of the one of the substrates of the firststack, and a wedge-shaped jig inserted into a corner of the first stack.The plurality of adsorption jigs include a mechanism that allows theadsorption jigs to move separately in a vertical direction and ahorizontal direction.

Note that in this specification and the like, ordinal numbers such as“first” and “second” are used in order to avoid confusion amongcomponents and do not limit the components numerically.

Another embodiment of the present invention is a processing apparatus ofa first stack including two substrates attached to each other with gapsprovided between their end portions. The processing apparatus includes afirst loader unit that feeds the first stack, a support feeding unitthat feeds a first support and a second support, a first separating unitthat separates one of the substrates of the first stack to form a firstremaining portion, a first attaching unit that attaches the firstsupport to the first remaining portion with the use of a first adhesivelayer, a first unloader unit that transports a second stack includingthe first remaining portion and the first support attached to each otherwith the first adhesive layer, a second loader unit that feeds thesecond stack, a starting point forming unit that forms a separationstarting point in the vicinities of end portions of the first remainingportion and the first support, a second separating unit that separatesthe other of the substrates of the second stack to form a secondremaining portion, a second attaching unit that attaches the secondsupport to the second remaining portion with the use of a secondadhesive layer, and a second unloader unit that transports a third stackincluding the second remaining portion and the second support attachedto each other with the second adhesive layer. The first separating unitincludes a fixing mechanism that fixes part of the first stack, aplurality of adsorption jigs that fix an outer peripheral edge of theone of the substrates of the first stack, and a wedge-shaped jiginserted into a corner of the first stack. The plurality of adsorptionjigs include a mechanism that allows the adsorption jigs to moveseparately in a vertical direction and a horizontal direction. Thesecond separating unit includes a fixing mechanism that fixes the otherof the substrates of the second stack, a plurality of adsorption jigsthat fix an outer peripheral edge of the first support of the secondstack, and a plurality of clamp jigs that fix part of the first supportof the second stack. The plurality of adsorption jigs and the pluralityof clamp jigs each include a mechanism that allows the plurality ofadsorption jigs or the plurality of clamp jigs to move separately in thevertical direction and the horizontal direction.

Another embodiment of the present invention is a method for processing astack including two substrates attached to each other with gaps providedbetween their end portions that includes the following steps: fixingpart of the stack to a fixing mechanism; moving a plurality ofadsorption jigs to fix an outer peripheral edge of the one of thesubstrates of the stack with the plurality of adsorption jigs; injectinga wedge-shaped jig into a corner of the stack; moving upward theadsorption jig that is closest to the corner among the plurality ofadsorption jigs to start separation of the one of the substrates of thestack; and selectively moving the adsorption jigs sequentially on thatthe separated region is increased from a starting point of theseparation.

The other embodiment of the present invention is a method for processinga stack including a flexible substrate that includes the followingsteps: fixing part of the stack to a fixing mechanism; moving aplurality of adsorption jigs to fix an outer peripheral edge of theflexible substrate of the stack with the plurality of adsorption jigs;moving some of the adsorption jigs to separate part of the flexiblesubstrate of the stack; fixing a plurality of clamp jigs to part of theseparated region; and moving the adsorption jigs and the clamp jigs tocarry on separation of the flexible substrate of the stack.

One embodiment of the present invention makes it possible to provide astack processing apparatus that inserts a wedge-shaped jig into a gapbetween two substrates attached to each other. It is possible to providea stack processing apparatus that senses a gap between two substratesattached to each other. It is possible to provide a stack processingapparatus that separates one substrate from the other substrate when thesubstrates are attached to each other with a gap provided therebetween.It is possible to provide a stack processing apparatus that separates astack including a component formed over a substrate and a flexiblesubstrate. It is possible to provide a stack processing apparatus thatseparates a stack including a component formed over a substrate and aflexible substrate with the use of jigs adsorbing part of the flexiblesubstrate. It is possible to provide a stack processing apparatus thatseparates a stack including a component formed over a substrate and aflexible substrate with the use of jigs adsorbing part of the flexiblesubstrate and a jig clamping and fixing part of the flexible substrate.It is possible to provide a processing apparatus in which one of twosubstrates attached to each other with a gap provided therebetween isseparated from the other thereof, and a flexible substrate is attachedto a remaining portion. It is possible to provide a stack processingapparatus in which one of two substrates attached to each other with agap provided therebetween is separated from the other thereof to form afirst remaining portion, a first flexible substrate is attached to thefirst remaining portion, the other of the substrates is separated toform a second remaining portion, and a second flexible substrate isattached to the second remaining portion. It is possible to provide anovel stack processing apparatus. It is possible to provide a novelmanufacturing apparatus. It is possible to provide a method forprocessing a stack with the use of any of the above stack processingapparatuses or the manufacturing apparatus.

Note that the description of these effects does not disturb theexistence of other effects. One embodiment of the present invention doesnot necessarily achieve all the objects listed above. Other effects willbe apparent from and can be derived from the description of thespecification, the drawings, the claims, and the like.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 illustrates a stack processing apparatus.

FIG. 2 illustrates a stack processing apparatus.

FIGS. 3A to 3C each illustrate a state before insertion of awedge-shaped jig into a processed member.

FIGS. 4A to 4C illustrate a separation step performed with a stackprocessing apparatus.

FIG. 5 illustrates a stack processing apparatus that includes a roller.

FIG. 6 illustrates a stack processing apparatus.

FIG. 7 illustrates a separation starting point formed in a processedmember.

FIGS. 8A and 8B illustrate a separation step performed with a stackprocessing apparatus.

FIGS. 9A to 9C illustrate a separation step performed with a stackprocessing apparatus.

FIG. 10 illustrates a separation step performed with the stackprocessing apparatus.

FIG. 11 illustrates a structure of a stack processing apparatus.

FIGS. 12A-1, 12A-2, 12B-1, 12B-2, 12C, 12D-1, 12D-2, 12E-1, and 12E-2illustrate a manufacturing process of a stack.

FIG. 13 illustrates a structure of a stack processing apparatus.

FIGS. 14A-1, 14A-2, 14B-1, 14B-2, 14C, 14D-1, 14D-2, 14E-1, and 14E-2illustrate a manufacturing process of a stack.

FIGS. 15A-1, 15A-2, 15B, 15C, 15D-1, 15D-2, 15E-1, and 15E-2 illustratea manufacturing process of a stack.

FIG. 16 illustrates a structure of a stack processing apparatus.

FIGS. 17A-1 and 17A-2 illustrate a processed member panel.

FIGS. 18A and 18B illustrate a light-emitting panel.

FIGS. 19A and 19B illustrate a light-emitting panel.

FIGS. 20A to 20C illustrate a method for manufacturing a light-emittingpanel.

FIGS. 21A to 21C illustrate a method for manufacturing a light-emittingpanel.

FIGS. 22A and 22B each illustrate a light-emitting panel.

FIG. 23 illustrates a light-emitting panel.

FIGS. 24A to 24D illustrate examples of electronic devices and lightingdevices.

FIGS. 25A and 25B illustrate an example of an electronic device.

FIG. 26 is a photograph of a stack processing apparatus.

FIG. 27 is a photograph of a stack processing apparatus.

FIG. 28 illustrates a sensor that senses the position (height) of aflexible substrate.

FIG. 29 is a flow chart for controlling a separation step.

FIG. 30 is a flow chart for controlling a separation step.

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments will be described in detail with reference to drawings. Notethat the present invention is not limited to the following descriptionand it will be readily appreciated by those skilled in the art thatmodes and details can be modified in various ways without departing fromthe spirit and the scope of the present invention. Therefore, thepresent invention should not be interpreted as being limited to thedescription of embodiments below. Note that in structures of the presentinvention described below, the same portions or portions having similarfunctions are denoted by the same reference numerals in differentdrawings, and description thereof is not repeated in some cases.

Embodiment 1

In this embodiment, a stack processing apparatus that is one embodimentof the present invention is described. Note that there is no particularlimitation on the usage of the stack processing apparatus. The stackprocessing apparatus is particularly useful in a manufacturing processof a semiconductor device, a display device, a light-emitting device, apower storage device, a power generation device, or the like thatincludes a flexible substrate.

One embodiment of the present invention can be used in a step oftransferring a component formed over a substrate to a flexiblesubstrate. For example, one embodiment of the present invention is usedin steps of attaching thin components formed over two substrates andthen separating one of the substrates. Although it is preferable to usea rigid substrate such as a glass substrate as the substrate, it is alsopossible to use a flexible substrate such as a resin substrate.

FIG. 1 is a perspective view of a stack processing apparatus that is oneembodiment of the present invention. The processing apparatus includes afixing stage 230 to which a processed member 200 is fixed, an adsorptionmechanism 240, and a wedge-shaped jig 250. Note that detail such aspower mechanism of each component is not illustrated in FIG. 1. Inaddition, a camera or the like may be provided to monitor and controlthe steps.

The processed member 200 that is processed by the processing apparatuscan be a member including a substrate 210, a substrate 220, and a thincomponent (not illustrated in FIG. 1) provided between the twosubstrates. Examples of the substrates 210 and 220 include a glasssubstrate, and examples of a component provided between the glasssubstrates include components of a light-emitting device and the like.

Note that when the substrate 210 is a substrate to be separated, aseparation layer is preferably formed between the substrate 210 and thecomponent to facilitate a separation step. In the separation step, theseparation layer remains on the substrate 210 side, and may also remainon the component side in some cases. It is preferable that a region tobe a separation starting point be formed in part of the separation layeror part of the component on the separation layer. Note that the regionto be the separation starting point can be formed by a physical meanssuch as a knife, laser processing, or the like.

As the fixing stage 230 to which the processed member 200 is fixed, forexample, a vacuum adsorption stage, an electrostatic adsorption stage,or the like can be used. Alternatively, the processed member 200 may befixed to the stage with a screwing jig or the like. At this time, theprocessed member 200 is aligned and fixed in a predetermined position.

The adsorption mechanism 240 includes a plurality of adsorption jigs241. The adsorption jigs are placed to fix the vicinity of the rim of afirst plane (the substrate 210 in FIG. 1) of the processed member 200.The adsorption jigs 241 each include a vertical movement mechanism 242and an adsorption portion 243. The vertical movement mechanisms 242 areincluded in the adsorption jigs 241 to independently control thevertical movements of the adsorption portions 243. The adsorptionportions 243 each have an inlet 243 a connected to a vacuum pump or thelike, and perform vacuum adsorption of the processed member 200. Amovable portion 245 is provided between an axis 244 of the verticalmovement mechanism 242 and the adsorption portion 243. The adsorptionjig 241 includes a means for movement in the horizontal directionindicated by a double-headed arrow. Thus, the substrate 210 can be keptadsorbed even when the substrate 210 is deformed or its position ischanged in the separation step. Note that the movable portion 245 may beformed using a mechanical mechanism including a joint or a material withelasticity such as a rubber or a spring. Although FIG. 1 illustrates theadsorption mechanism 240 including the twelve adsorption jigs, thestructure is not limited thereto. The number of adsorption jigs 241, thesize of the adsorption portion 243, and the like may be determineddepending on the size and the physical property of the processed member200. FIG. 26 is a photograph of the stack processing apparatus of oneembodiment of the present invention that includes the fixing stage 230and the adsorption jigs 241.

As the wedge-shaped jig 250, a blade jig can be used. Here, thewedge-shaped jig 250 pushes the attached substrates 210 and 220 apart bybeing inserted into an extremely narrow gap between the substrates 210and 220. For this reason, it is preferable that the thickness of thepointed tip of the wedge-shaped jig 250 be smaller than the gap and thethickness of a plate-like portion of the wedge-shaped jig 250 be largerthan the gap. A sensor 255 that senses an inserted position of thewedge-shaped jig 250 may be included. Note that the term “gap” in thisembodiment refers to a region in which the component is not providedbetween the substrate 210 and the substrate 220, and mainly refers to aregion of outer edges of the substrates.

Furthermore, a nozzle 270 to which liquid is supplied is preferablyprovided in the vicinity of the position of the processed member 200where the wedge-shaped jig 250 is inserted. As the liquid, water can beused, for example. When water exists in a portion where the separationis in process, separation strength can be decreased. Moreover,electrostatic discharge damage to an electronic device or the like canbe prevented. As the liquid, an organic solvent or the like can be usedinstead of water; for example, a neutral, alkaline, or acid aqueoussolution may be used.

FIG. 2 illustrates a perspective view of a state in which a side of theprocessed member 200 that is not separated (the substrate 220) is fixedto the fixing stage 230, the plurality of adsorption jigs 241 includedin the adsorption mechanism 240 are adsorbed onto a separated side ofthe processed member 200 (the substrate 210), and the wedge-shaped jig250 is inserted into a gap in the processed member 200.

Here, a state before the wedge-shaped jig 250 is inserted into the gapin the processed member 200 is illustrated in cross-sectional views ofFIGS. 3A to 3C. In FIGS. 3A to 3C, a component 260 provided between thesubstrates 210 and 220 has extremely small thickness, and thus theprocessed member 200 has an extremely narrow gap. Given that thecomponent 260 is a component of a light-emitting device, the gap isapproximately 10 μm to 15 μm, and it is very difficult to fix theposition of the wedge-shaped jig 250 and insert the wedge-shaped jig 250into the gap. Therefore, it is preferable that the position of the gapor the thickness of the substrate be sensed with the use of the sensor255 (e.g., an optical sensor, a displacement sensor, or a camera)illustrated in FIG. 1, and then the wedge-shaped jig 250 be insertedinto the gap.

In addition, it is preferable that a structure in which the wedge-shapedjig 250 can move in the thickness direction of the processed member 200be employed and a substrate whose end portions are chamfered be used forthe processed member 200. Thus, it is possible to include chamfers in anarea to which the wedge-shaped jig 250 can be inserted, and the areaincluding the chamfers on the gap side is sensed with the sensor 755.

FIG. 3A illustrates the cross-sectional view of the substrates subjectedto C chamfering. When the tip of the wedge-shaped jig 250 is insertedtoward a C chamfer, the tip of the wedge-shaped jig 250 slides along theC chamfer and is guided to the gap. Thus, it is possible to increase anarea H to which the wedge-shaped jig 250 can be inserted.

FIG. 3B illustrates the cross-sectional view of the substrates subjectedto R chamfering. When the tip of the wedge-shaped jig 250 is insertedtoward an R chamfer, the tip of the wedge-shaped jig 250 slides alongthe R chamfer and is guided to the gap. Thus, the area H in the case ofthe R chamfering in FIG. 3B can be larger than that in the case of the Cchamfering in FIG. 3A.

FIG. 3C illustrates the cross-sectional view of the substrates that arenot subjected to chamfering, which indicates that the area H is verysmall. In FIG. 3C, when the wedge-shaped jig 250 moves toward outsidethe area H, the processed member 200 might be broken, which reduces theyield in a process. In addition, an adverse effect is exerted in thecase of reusing the substrates 210 and 220 used in the processed member200. In view of the above, the substrates whose end portions arechamfered are preferably used in the processed member 200 as illustratedin FIGS. 3A and 3B.

As illustrated in FIG. 2, when the wedge-shaped jig 250 is inserted intoa gap in a corner of the processed member 200 to push the attachedsubstrates 210 and 220 apart, separation starts in the region to be theseparation starting point that is formed in advance. At this time, wateris preferably supplied to the portion where the separation is in processas described above.

Note that in a separation step described in the following process, theseparation is preferably performed successively without being stopped,and is more preferably performed with constant velocity. When theseparation is stopped in the middle and then started in the same region,distortion or the like occurs in the region, which does not occur in thecase where the separation is successively performed. Thus, a minutestructure of the region and the characteristics of an electronic devicein the region are changed, which might influence display of a displaydevice, for example.

Therefore, in the step of carrying on the separation by inserting thewedge-shaped jig 250, the separation is preferably stopped in apredetermined region in the component 260 so as not to cause a defectiveproduct. For example, in the case of a display device, separation may bestopped before it reaches a region where a pixel and a driver circuitare provided.

An example of the separation step is described with reference to FIGS.4A to 4C. Note that some of the components illustrated in FIG. 2 areomitted in FIGS. 4A to 4C for simplicity. An arrow illustrated with eachadsorption jig schematically illustrates the move distance in the upwarddirection of the adsorption portion 243 which is included in eachadsorption jig, or strength required of lifting the adsorption portion243 upward.

After the wedge-shaped jig 250 is inserted into the gap in the corner ofthe processed member 200 and the separation starts, the adsorptionportion 243 included in the adsorption jig 241 a which is closest to thecorner is moved slowly. Then, the adsorption portions 243 included inthe corresponding adsorption jigs are moved sequentially so that theseparation is carried on in a direction 291 indicated by an arrow inFIG. 4A; thus, one side of the processed member 200 is separated.

Next, as illustrated in FIG. 4B, the adsorption portions 243 included inthe corresponding adsorption jigs are moved sequentially so that theseparation is carried on from the separated side of the processed member200 in a direction 292 indicated by an arrow.

Then, as illustrated in FIG. 4C, the adsorption portions 243 included inthe corresponding adsorption jigs are moved sequentially so that aposition on the diagonal line of the corner of the processed member 200to which the wedge-shaped jig 250 is inserted becomes a separation endpoint; thus, the separation is carried on in a direction 293 indicatedby an arrow.

Note that in the separation step, the separation rate is preferablymanaged. When the movement of the adsorption portions 243 of theadsorption jigs is fast and the separation cannot follow the movement,the separated portion is cut. For this reason, it is preferable that theangle between the substrates 210 and 220 in the separation, tractiveforce in the movement of the adsorption portions 243 included in theadsorption jigs, and the like be managed with the use of imageprocessing, a displacement sensor, a pull gauge, or the like to preventthe separation rate from being excessively high.

The stack processing apparatus that is one embodiment of the presentinvention may include a roller 280 as illustrated in FIG. 5. When it isdifficult to adjust the separating position or the separation rate onlyby the adsorption jigs 241, the use of the roller can facilitate theadjustment.

In addition, to remove water or the like that remains after theseparation step, a dryer or the like may be provided. Water can beremoved by spraying a gas such as the air or a N₂ gas to the substrate,for example.

With the use of the stack processing apparatus that is one embodiment ofthe present invention in the above manner, a crack in the substrate,cutting of the separated portion, and the like are less likely to occurand the separation step of the processed member 200 can be performedwith a high yield.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 2

In this embodiment, a different mode of the stack processing apparatusthat is one embodiment of the present invention from Embodiment 1 isdescribed. Note that there is no particular limitation on the usage ofthe processing apparatus. It is useful to use the processing apparatusin manufacturing process of, in particular, a semiconductor device witha flexible substrate, a display device, a light-emitting device, a powerstorage device, a power generation device, or the like.

One embodiment of the present invention can be used in a step oftransferring a component formed over a substrate to a flexiblesubstrate. For example, in the case of a stack in which a component anda flexible substrate are stacked in this order over a substrate, oneembodiment of the present invention is used in a step of separating thecomponent and the flexible substrate from the substrate. Although it ispreferable to use a rigid substrate such as a glass substrate as thesubstrate, it is also possible to use a flexible substrate such as aresin substrate.

FIG. 6 is a perspective view of a stack processing apparatus that is oneembodiment of the present invention. The processing apparatus includes afixing stage 231 to which a processed member 201 is fixed, an adsorptionmechanism 1240, and clamp jigs 281. Note that detail such as powermechanism of each component is not illustrated in FIG. 6. In addition, acamera or the like may be provided to monitor and control the steps.

The processed member 201 that is processed by the processing apparatuscan be a member including a flexible substrate 215, a substrate 212, anda thin component (not illustrated in FIG. 6) provided between theflexible substrate 215 and the substrate 212. Examples of the componentprovided between the flexible substrate 215 and the substrate 212include components and the like of a light-emitting device.

Note that when the flexible substrate 215 and the component areseparated, a separation layer is preferably formed between the componentand the substrate 212 to facilitate a separation step. In the separationstep, the separation layer remains on the substrate 212 side, and mayalso remain on the component side in some cases. It is preferable that aregion to be a separation starting point be formed in part of thecomponent on the separation layer and part of the flexible substrate215. The region is formed by making a slit 211 in the flexible substrate215 and the component as illustrated in a top view of FIG. 7. The slitreaches the separation layer to form the separation starting point, sothat a region surrounded by the slit is separated. Note that the slit211 can be made with a physical means such as a knife, laser processing,or the like.

As the fixing stage 231 to which the processed member 201 is fixed, forexample, a vacuum adsorption stage, an electrostatic adsorption stage,or the like can be used. Alternatively, the processed member 201 may befixed to the stage with a screwing jig or the like. At this time, theprocessed member 201 is aligned and fixed in a predetermined position.

The adsorption mechanism 1240 includes a plurality of adsorption jigs1241. The adsorption jigs are placed to fix the vicinity of the rim of afirst plane (the flexible substrate 215 in FIG. 6) of the processedmember 201. The adsorption jigs 1241 each include a vertical movementmechanism 1242 and an adsorption portion 1243. The vertical movementmechanisms 1242 are included in the adsorption jigs 1241 toindependently control the vertical movements of the adsorption portions1243. The adsorption portions 1243 each have an inlet 1243 a connectedto a vacuum pump or the like, and perform vacuum adsorption of theprocessed member 201. A movable portion 1245 is provided between an axis1244 of the vertical movement mechanism 1242 and the adsorption portion1243. The adsorption jig 1241 includes a means for movement in thehorizontal direction indicated by a double-headed arrow. Thus, theflexible substrate 215 can be kept adsorbed even when the flexiblesubstrate 215 is deformed or its position is changed in the separationstep. Note that the movable portion 1245 may be formed using amechanical mechanism including a joint or a material with elasticitysuch as a rubber or a spring. Although FIG. 6 illustrates the adsorptionmechanism 1240 including the six adsorption jigs, the structure is notlimited thereto. The number of adsorption jigs 1241, the size of theadsorption portion 1243, and the like may be determined depending on thesize and the physical property of the processed member 201.

As a needle 251, a rigid protrusion can be used. For example, the needle251 is inserted into a corner of the slit 211 that is to be theseparation starting point illustrated in FIG. 7, and is pressed onto theflexible substrate 215 and slides or is operated so as to turn over theflexible substrate 215. Thus, the separation is partly carried on, whichfacilitates the subsequent step. Note that the insertion position of theneedle 251 can be sensed with image processing, a displacement sensor,or the like. In the case where a needed amount of separated area isobtained at the time of making the slit 211 or in other steps, the stepof using the needle does not need to be performed. In this case, theneedle 251 can be omitted in the structure of the stack processingapparatus that is one embodiment of the present invention.

Furthermore, a nozzle 271 to which liquid is supplied is preferablyprovided in a corner of the processed member 201 or in the vicinity ofthe position where the separation starts. As the liquid, water can beused, for example. When water exists in a portion where the separationis in process, separation strength can be decreased. Moreover,electrostatic discharge damage to an electronic device or the like canbe prevented. As the liquid, an organic solvent or the like can be usedinstead of water; for example, a neutral, alkaline, or acid aqueoussolution may be used.

The clamp jigs 281 clamp part of the flexible substrate 215 to fix itand allow the part to be moved in the vertical direction and thehorizontal direction. The separation step can be performed with only theadsorption jigs 1241 included in the adsorption mechanisms 1240;however, with only the adsorption jigs 1241 that fix only part of theflexible substrate 215, the flexible substrate 215 is deformed, whichmakes it is difficult to carry on the separation uniformly. When theflexible substrate 215 is deformed, the adsorption jigs might come offor the component might be cut, for example. For this reason, it ispreferable that the separation is performed stably in the followingmanner: the flexible substrate 215 is fixed with the clamp jigs 281 inaddition to the adsorption jigs 1241, and then the clamp jigs are pulledin the vertical direction and the horizontal direction to make theflexible substrate 215 under tension. FIG. 27 is a photograph of thestack processing apparatus of one embodiment of the present inventionthat includes the fixing stage 231, the adsorption portions 1243, andthe clamp jigs 281.

Next, description is given of an example of a separation step using thestack processing apparatus that is one embodiment of the presentinvention. Note that in the processed member 201 used in the separationstep, a thin component is provided between the flexible substrate 215and the substrate 212, and a separation layer is provided between thesubstrate 212 and the component. In addition, a slit that reaches theseparation layer (i.e., separation starting point) is made in theflexible substrate 215 and the component. An arrow illustrated with eachadsorption jig schematically illustrates the move distance in the upwarddirection of the adsorption portion 1243 which is included in eachadsorption jig, or strength required of lifting the adsorption portion1243 upward.

First, as illustrated in FIG. 8A, the needle 251 is inserted into acorner of the slit 211, and is pressed onto the flexible substrate 215or is operated so as to turn over the flexible substrate 215; thus, theseparation is partly carried on. Here, when the separation is notcarried on adequately, the separation step cannot be performed with theadsorption jigs in a later step. Note that as described above, in thecase where a needed amount of separated area has been obtained, the stepof using the needle does not need to be performed. Then, through thenozzle 271, water is injected into the region where the separation iscarried on.

Next, as illustrated in FIG. 8B, the adsorption portions 1243 includedin the plurality of adsorption jigs 1241 are adsorbed onto the flexiblesubstrate 215 on the first plane of the processed member 201. Theadsorption portion 1243 included in the adsorption jig 1241 a which isclosest to the corner where the separation is carried on is movedupward, and then the adsorption portions 1243 included in the adsorptionjig 1241 along an arrow are sequentially moved upward.

Through the above operation, the adsorption portions 1243 included inthe adsorption jigs 1241 b and surrounded by a dotted frame in FIG. 9Aare moved upward, whereby the first side of the flexible substrate 215that is the first plane of the processed member 201 is separated.

Next, as illustrated in FIG. 93, the clamp jigs 281 are inserted intoregions between the adsorption jigs 1241 b, and clamp part of theseparated flexible substrate 215. There is no limitation on thestructure of the clamp jigs 281. For example, a mechanism can be used inwhich two parts including holding portions are in contact with a spindleand one or both of the two parts move to allow sandwiching.Alternatively, a mechanism can be used in which one or both of two partsincluding holding portions move while being parallel to each other, andthus performing sandwiching.

Then, as illustrated in FIG. 9C, the adsorption portions 1243 includedin the adsorption jigs 1241 b are moved upward, and the clamp jigs 281are moved in the vertical direction and the horizontal direction; thus,the separation is carried on from the first side to the second sidewhile the flexible substrate 215 is made under tension. Finally, theadsorption portions 1243 included in all the adsorption jigs 1241 aremoved upward to complete the separation step. Note that to perform theseparation stably it is preferable to control the operation of theadsorption portions 1243 so that the separation end point is at a corneron the second side.

In FIG. 9C, the clamp jigs 281 are moved in vertical to an end surfaceof the first side of the flexible substrate 215. However, as illustratedin FIG. 10, the clamp jigs 281 may be moved in the following manner: theclamp jigs 281 are fixed to be inclined to the end surface of the firstside of the flexible substrate 215 and moved in the inclined direction.It becomes easy to apply tension uniformly to the whole region where theflexible substrate 215 is separated, which makes it possible to performthe separation step more stably without the component being cut in theportion where the separation is carried on. Furthermore, in the modeillustrated in FIG. 9C, the clamp jigs 281 may be fixed to the flexiblesubstrate 215 and moved in directions as illustrated in FIG. 10.

In this embodiment, the six adsorption jigs 1241 are included in theadsorption mechanism 1240, the first side of the first plane of theprocessed member 201 that is on a side where the separation starts isfixed by the three adsorption jigs 1241, and the second side on a sidewhere the separation ends is fixed by the three adsorption jigs 1241.The number of adsorption jigs in one embodiment of the present inventionis not limited thereto. For example, the number of the adsorption jigs1241 may be increased to fix the third and fourth sides of the firstplane of the processed member 201. When the n adsorption jigs 1241 fixthe first side of the first plane of the processed member 201 (n is aninteger of two or more), the n−1 clamp jigs 281 are used to fix andclamp the flexible substrate 215 at spaces between the adsorption jigs1241, for example. In the case where the clamp jigs 281 are fixed to beinclined as illustrated in FIG. 10 at this time, the closer the clampjig 281 is placed to the center of the flexible substrate 215, thesmaller the inclination of the clamp jig 281 is. This facilitatesuniform application of tension to the whole region where the separationis performed even when the flexible substrate 215 has a large area.

Note that in the separation step, the separation rate is preferablymanaged. When the movement of the adsorption jigs and the clamp jigs 281is fast and the separation cannot follow the movement, the separatedportion is cut. For this reason, it is preferable that the angle betweenthe flexible substrate 215 and the substrate 212 in the separation,tractive force in the movement of the adsorption jigs and the clampjigs, and the like be managed with the use of image processing, adisplacement sensor, a pull gauge, or the like to prevent the separationrate from being excessively high.

As another example, a sensor 256 which detects the height of theflexible substrate 215 can be used as illustrated in FIG. 28. Theposition of the sensor 256 may be fixed; alternatively, a mechanism thatallows movement in a direction in which the separation is carried on maybe included. When the sensor 256 is fixed in the position illustrated inFIG. 28, the sensor 256 can be operated according to the flow chart ofFIG. 29, for example.

First, the adsorption jigs 1241 on the side where the separation startsare moved upward, and the separation starts. After a predeterminedperiod which is set in advance with a timer 1, the position (height) ofa surface of the flexible substrate 215 is measured with the sensor 256.Here, when the position is higher than a predetermined position, theadsorption jigs 1241 on the side where the separation ends are movedupward after a predetermined period which is set in advance with a timer2, whereby the separation step is completed. When the position (height)of the surface of the flexible substrate 215 is lower than thepredetermined position, end time of the separation is calculated. Theend time can be estimated by the time of the timer 1 and the measuredposition (height) of the surface of the flexible substrate 215. Then, atimer 3 is set for a period longer than the end time, and the adsorptionjigs 1241 on the side where the separation ends after the predeterminedperiod are moved upward; thus, the separation step is completed. In theabove manner, the separation step can be performed appropriately evenwhen the processed members 201 with different separation rates areprocessed.

In addition, as illustrated in the flow chart of FIG. 30, the end timeof the separation may be calculated in the processing of each of theprocessed members 201.

The sensor 256 may be set in a position where the position (height) ofthe flexible substrate 215 in the vicinity of the adsorption jigs 1241on the separation end side can be measured. In this case, the adsorptionjigs 1241 on the separation end side may be moved upward after a changein the position (height) of the flexible substrate 215 in the positionis measured to sense that the separation is close to the end.

Note that the sensor 256 can be provided in the stack processingapparatus that is described in Embodiment 1.

Note that a dryer for removing water or the like remaining after theseparation step, an ultrasonic dry cleaner for removing a foreignsubstance, or the like may be provided.

With the use of the stack processing apparatus that is one embodiment ofthe present invention in the above manner, cutting of the component inthe separated portion and the like are less likely to occur and theseparation step of the processed member 201 can be performed with a highyield.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 3

In this embodiment, description is given of a stack processing apparatusincluding the stack processing apparatus in Embodiment 1 that is oneembodiment of the present invention.

FIG. 11 is a schematic diagram illustrating a structure of a stackprocessing apparatus 1000 that is one embodiment of the presentinvention, and the conveyance path of a processed member and a stack ina process.

FIGS. 12A-1, 12A-2, 12B-1, 12B-2, 12C, 12D-1, 12D-2, 12E-1, and 12E-2are schematic views illustrating a process for manufacturing a stackwith the use of the stack processing apparatus 1000 that is oneembodiment of the present invention. FIGS. 12A-1, 12B-1, 12D-1, and12E-1 are cross-sectional views illustrating structures of a processedmember and a stack. FIGS. 12A-2, 12B-2, 12D-2, and 12E-2 are top viewscorresponding to the cross-sectional views.

The processing apparatus 1000 includes a first loader unit 100, a firstseparating unit 300, a first attaching unit 400, and a support feedingunit 500 (see FIG. 11). Note that each unit can be named freely, and thename does not limit the function of each unit.

Note that the stack processing apparatus described in Embodiment 1corresponds to the first separating unit 300.

The first loader unit 100 can feed a processed member 80. Note that thefirst loader unit 100 can also serve as a first unloader unit.

The first separating unit 300 separates one surface 80 b of theprocessed member 80 to form a first remaining portion 80 a (see FIG. 11and FIGS. 12A-1, 12A-2, 12B-1, 12B-2, and 12C).

Note that the one surface 80 b of the processed member 80 corresponds tothe substrate 210 in Embodiment 1, and the first remaining portion 80 acorresponds to the remaining portion (the substrate 220 and thecomponent 260) obtained by separating the substrate 210 from theprocessed member 200 in Embodiment 1.

The first attaching unit 400 is fed with a first support 41, andattaches the first support 41 to the first remaining portion 80 a withthe use of a first adhesive layer 31 (see. FIG. 11 and FIGS. 12D-1,12D-2, 12E-1, and 12E-2).

The support feeding unit 500 feeds the first support 41 (see FIG. 11).

The first loader unit 100 also serving as the first unloader unittransports a stack 81 including the first remaining portion 80 a and thefirst support 41 that are attached to each other with the first adhesivelayer 31 (see FIG. 11 and FIGS. 12E-1 and 12E-2).

The stack processing apparatus of one embodiment of the presentinvention includes the first loader unit 100 also serving as the firstunloader unit that feeds the processed member 80 and transports thestack 81 including the first remaining portion 80 a and the firstsupport 41 attached to each other with the first adhesive layer 31; thefirst separating unit 300 that separates the first remaining portion 80a; the first attaching unit 400 that attaches the first support 41 tothe first remaining portion 80 a; and the support feeding unit 500 thatfeeds the first support 41. This structure makes it possible to separatethe one surface of the processed member 80 to form the first remainingportion 80 a, and attach the first support 41 to the first remainingportion 80 a. Consequently, a novel stack processing apparatus includingthe first remaining portion of the processed member and the firstsupport can be provided.

Furthermore, the stack processing apparatus 1000 in this embodimentincludes a first storage portion 300 b, a first cleaning device 350, aconveying means 111, and the like.

The first storage portion 300 b stores the one surface 80 b separatedfrom the processed member 80.

The first cleaning device 350 cleans the first remaining portion 80 aobtained from the processed member 80.

The conveying means 111 conveys the processed member 80, the firstremaining portion 80 a, and the stack 81.

The following describes individual components included in the stackprocessing apparatus that is one embodiment of the present invention.

<<First Loader Unit>>

The first loader unit 100 can feed the processed member 80. For example,to allow the conveying means 111 to convey a plurality of processedmembers 80 successively, a multistage storage capable of storing theplurality of processed members 80 can be included.

Furthermore, the first loader unit 100 in this embodiment also serves asthe first unloader unit. The first loader unit 100 transports the stack81 including the first remaining portion 80 a, the first adhesive layer31, and the first support 41 attached to the first remaining portion 80a with the first adhesive layer 31. For example, to allow the conveyingmeans 111 to convey a plurality of processed members 81 successively, amultistage storage capable of storing the plurality of processed members81 can be included.

<<First Separating Unit>>

The first separating unit 300 includes a means for holding one surfaceof the processed member 80 and a means for holding the other surfacefacing the one surface. Both means are pulled away from each other,whereby the one surface of the processed member 80 is separated to formthe first remaining portion 80 a. Note that the detailed description ofthe first separating unit 300 can be referred to for the description inEmbodiment 1.

<<First Attaching Unit>>

The first attaching unit 400 includes a means for forming the firstadhesive layer 31 and a bonding means for attaching the first remainingportion 80 a and the first support 41 to each other with the use of thefirst adhesive layer 31.

Examples of the means for forming the first adhesive layer 31 include adispenser for applying a liquid adhesive and a device feeding anadhesive sheet shaped as a sheet in advance.

Note that the first adhesive layer 31 may be formed on the firstremaining portion 80 a and/or the first support 41. Specifically, thefirst support 41 on which the first adhesive layer 31 is formed inadvance may be used.

Examples of the bonding means for attaching the first remaining portion80 a and the first support include means for applying pressure that arecontrolled to apply a constant pressure or provide a uniform gap, suchas a pair of rollers, a flat plate and a roller, and a pair of flatplates facing each other.

<<Support Feeding Unit>>

The support feeding unit 500 feeds the first support 41. For example,the support feeding unit 500 unrolls a film which is fed in a rolledshape, cuts the film to a predetermined length, activates a surface ofthe film, and feeds the film as the first support 41.

A method for manufacturing the stack 81 from the processed member 80with the use of the stack processing apparatus 1000 is described belowwith reference to FIG. 11 and FIGS. 12A-1, 12A-2, 12B-1, 12B-2, 12C,12D-1, 12D-2, 12E-1 and 12E-2.

The processed member 80 includes a first substrate 11, a firstseparation layer 12 on the first substrate 11, a first layer 13 to beseparated (hereinafter simply referred to as the first layer 13) whoseone surface is in contact with the first separation layer 12, a bondinglayer 30 whose one surface is in contact with the other surface of thefirst layer 13, a base 25 in contact with the other surface of thebonding layer 30 (see FIGS. 12A-1 and 12A-2). Note that a method formanufacturing the processed member 80 is described in Embodiment 5.

<<First Step>>

The processed member 80 is conveyed to the first loader unit 100. Theprocessed member 80 is fed from the first loader unit 100 to the firstseparating unit 300 by being conveyed with the conveying means 111. Notethat in this embodiment, description is given of a case of using theprocessed member 80 in which separation starting points 13 s are formedin advance in the vicinity of end portions of the bonding layer 30 (seeFIGS. 12B-1 and 12B-2).

<<Second Step>>

The first separating unit 300 separates the one surface 80 b of theprocessed member 80. Specifically, from the separation starting point 13s formed in the vicinity of the end portion of the bonding layer 30, thefirst substrate 11 is separated from the first layer 13 together withthe first separation layer 12 (see FIG. 12C).

Through this step, the first remaining portion 80 a can be obtained fromthe processed member 80. Specifically, the first remaining portion 80 aincludes the first layer 13, the bonding layer 30 whose one surface isin contact with the first layer 13, and the base 25 in contact with theother surface of the bonding layer 30.

<<Third Step>>

The conveying means 111 conveys the first remaining portion 80 a, andthe support feeding unit 500 feeds the first support 41.

The first attaching unit 400 forms the first adhesive layer 31 on thefed first remaining portion 80 a (see FIGS. 12D-1 and 12D-2), andattaches the first remaining portion 80 a and the first support 41 toeach other with the use of the first adhesive layer 31.

Through this step, the stack 81 is obtained from the first remainingportion 80 a. Specifically, the stack 81 includes the first support 41,the first adhesive layer 31, the first layer 13, the bonding layer 30whose one surface is in contact with the first layer 13, and the base 25in contact with the other surface of the bonding layer 30 (see FIGS.12E-1 and 12E-2).

<<Fourth Step>>

The conveying means 111 conveys the stack 81, and the stack 81 is fedinto the first loader unit 100 also serving as the first unloader unit.

Through this step, the stack 81 is ready to be transported.

<<Other Step>>

Note that when it takes time to cure the first adhesive layer 31, thestack 81 in which the first adhesive layer 31 is not cured yet ispreferably transported to cure the first adhesive layer 31 outside thestack processing apparatus 1000, in which case occupancy time of theapparatus can be reduced.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 4

In this embodiment, description is given of a stack processing apparatusincluding the stack processing apparatuses in Embodiments 1 to 3 thatare embodiments of the present invention.

FIG. 13 is a schematic diagram illustrating a structure of a stackprocessing apparatus 1000B that is one embodiment of the presentinvention, and the conveyance path of a processed member and a stack ina process.

FIGS. 14A-1, 14A-2, 14B-1, 14B-2, 14C, 14D-1, 14D-2, 14E-1, and 14F-2and FIGS. 15A-1, 15A-2, 15B, 15C, 15D-1, 15D-2, 15E-1, and 15E-2 areschematic views illustrating a process for manufacturing a stack withthe use of the stack processing apparatus 1000B that is one embodimentof the present invention. FIGS. 14A-1, 14B-1, 14D-1, and 14E-1 and FIGS.15A-1, 15D-1, and 15E-1 are cross-sectional views illustratingstructures of a processed member and a stack. FIGS. 14A-2, 14B-2, 14D-2,and 14E-2 and FIGS. 15A-2, 15D-2, and 15E-2 are top views correspondingto the cross-sectional views.

The stack processing apparatus 1000B in this embodiment includes thefirst loader unit 100, the first separating unit 300, the firstattaching unit 400, the support feeding unit 500, a second loader unit600, a starting point forming unit 700, a second separating unit 800,and a second attaching unit 900. Note that each unit can be namedfreely, and the name does not limit the function of each unit.

Note that the stack processing apparatus described in Embodiment 1corresponds to the first separating unit 300.

The first loader unit 100 can feed a processed member 90. Note that thefirst loader unit 100 can also serve as a first unloader unit.

The first separating unit 300 separates one surface 90 b of theprocessed member 90 to form a first remaining portion 90 a (see FIGS.14A-1, 14A-2, 14B-1, 14B-2, and 14C).

Note that the one surface 90 b of the processed member 90 corresponds tothe substrate 210 in Embodiment 1, and the first remaining portion 90 acorresponds to the remaining portion (the substrate 220 and thecomponent 260) obtained by separating the substrate 210 from theprocessed member 200 in Embodiment 1.

The first attaching unit 400 is fed with the first support 41, andattaches the first support 41 to the first remaining portion 90 a withthe use of the first adhesive layer 31 (see FIGS. 14D-1, 14D-2, 14E-1,and 14E-2).

The support feeding unit 500 feeds the first support 41 and a secondsupport 42.

The first loader unit 100 also serving as the first unloader unittransports a stack 91 including the first remaining portion 90 a and thefirst support 41 that are attached to each other with the first adhesivelayer 31 (see FIGS. 14E-1 and 14E-2).

The second loader unit 600 can feeds the stack 91. Note that the secondloader unit 600 can also serve as a second unloader unit.

The starting point forming unit 700 forms separation starting points 91s in the vicinity of end portions of the first remaining portion 90 aand a first support 41 b in the stack 91 (see FIGS. 15A-1 and 15A-2).

The second separating unit 800 separates one surface 91 b of the stack91 to form a second remaining portion 91 a (see FIG. 15B).

Note that the stack processing apparatus described in Embodiment 2corresponds to the second separating unit 800.

The one surface 91 b of the stack 91 corresponds to the substrate 212described in Embodiment 2, and the second remaining portion 91 acorresponds to the flexible substrate 215 and the component described inEmbodiment 2.

The second attaching unit 900 is fed with the second support 42, andattaches the second support 42 to the second remaining portion 91 a withthe use of a second adhesive layer 32 (see FIGS. 15D-1, 15D-2, 15E-1,and 15E-2).

The second loader unit 600 also serving as the second unloader unittransports a stack 92 including the second remaining portion 91 a andthe second support 42 that are attached to each other with the secondadhesive layer 32 (see FIG. 13 and FIGS. 15E-1 and 15E-2).

The stack processing apparatus in this embodiment includes the firstloader unit 100 also serving as the first unloader unit that feeds theprocessed member 90 and transports the stack 91 including the firstremaining portion 90 a and the first support 41 attached to each otherwith the first adhesive layer 31; the first separating unit 300 thatseparates the first remaining portion 90 a; the first attaching unit 400that attaches the first support 41 to the first remaining portion 90 a;and the support feeding unit 500 that feeds the first support 41 and thesecond support 42; the second loader unit 600 that feeds the stack 91and transports the stack 92 including the second remaining portion 91 aand the second support 42 attached to each other with the secondadhesive layer 32; the starting point forming unit 700 that forms aseparation starting point; the second separating unit 800 that separatesthe second remaining portion 91 a; and the second attaching unit 900that attaches the second support 42 to the second remaining portion 91a. This structure makes it possible to separate the both surface of theprocessed member 90 to form the second remaining portion 91 a, andattach the first support 41 and the second support 42. Consequently, anovel processing apparatus of the stack including the second remainingportion of the processed member, the first support, and the secondsupport can be provided.

Furthermore, the stack processing apparatus 1000B in this embodimentincludes the first storage portion 300 b, a second storage portion 800b, the first cleaning device 350, a second cleaning device 850, theconveying means 111, a conveying means 112, and the like.

The first storage portion 300 b stores the one surface 90 b separatedfrom the processed member 90.

The second storage portion 800 b stores the one surface 91 b separatedfrom the stack 91.

The first cleaning device 350 cleans the first remaining portionobtained from the processed member 90.

The second cleaning device 850 cleans the second remaining portion 91 aobtained from the stack 91.

The conveying means 111 conveys the processed member 90, the firstremaining portion 90 a obtained from the processed member 90, and thestack 91.

The conveying means 112 conveys the stack 91, the second remainingportion 91 a obtained from the stack 91, and the stack 92.

The following describes individual components included in the stackprocessing apparatus that is one embodiment of the present invention.

Note that the stack processing apparatus 1000B is different from thestack processing apparatus 1000 described in Embodiment 3 in that thesecond loader unit 600, the starting point forming unit 700, the secondseparating unit 800, the second attaching unit 900, the second storageportion 800 b, and the second cleaning device 850 are included. In thisembodiment, a structure different from that of the stack processingapparatus 1000 is described, and the description in Embodiment 3 isreferred to for a structure common to that of the stack processingapparatus 1000.

<<Second Loader Unit>>

The second loader unit 600 can have the same structure as the firstloader unit described in Embodiment 3 except that the second loader unit600 feeds the stack 91.

Furthermore, the second loader unit 600 in this embodiment also servesas the second unloader unit.

<<Starting Point Forming Unit>>

The starting point forming unit 700 includes a cutting means which cutsthe first support 41 and the first adhesive layer 31 and separates partof a second layer 23 to be separated (hereinafter simply referred to asthe second layer 23) from a second separation layer 22, for example.

Specifically, the cutting means includes one or a plurality of bladeswhich have a sharp tip, and relatively moves the blade to the stack 91.

<<Second Separating Unit>>

The second separating unit 800 includes a means for holding one surfaceof the stack 91 and a means for holding the other surface facing the onesurface. Both means are pulled away from each other, whereby the onesurface of the stack 91 is separated to form the second remainingportion 91 a.

<<Second Attaching Unit>>

The second attaching unit 900 includes a means for forming the secondadhesive layer 32 and a bonding means for attaching the second remainingportion 91 a and the second support 42 to each other with the use of thesecond adhesive layer 32.

The means for forming the second adhesive layer 32 can have a structuresimilar to that of the first attaching unit 400 described in Embodiment3.

Note that the second adhesive layer 32 may be formed on the secondremaining portion 91 a and/or the second support 42. Specifically, thesecond support 42 on which the second adhesive layer 32 is formed inadvance may be used.

The bonding means for attaching the second remaining portion 91 a andthe second support 42 to each other can have a structure similar to thatof the first attaching unit 400 described in Embodiment 3.

A method for manufacturing the stack 91 from the processed member 90with the use of the stack processing apparatus 1000B is described belowwith reference to FIG. 13, FIGS. 14A-1, 14A-2, 14B-1, 14B-2, 14C, 14D-1,14D-2, 14E-1, and 14E-2, and FIGS. 15A-1, 15A-2, 15B, 15C, 15D-1, 15D-2,15E-1, and 15E-2.

The processed member 90 has the same structure as the processed member80 except that a first base includes a second substrate 21, the secondseparation layer 22 on the second substrate 21, and the second layer 23whose one surface is in contact with the second separation layer 22.

Specifically, the processed member 90 includes the first substrate 11,the first separation layer 12 on the first substrate 11, the first layer13 whose one surface is in contact with the first separation layer 12,the bonding layer 30 whose one surface is in contact with the othersurface of the first layer 13, the second layer 23 whose one surface isin contact with the other surface of the bonding layer 30, the secondseparation layer whose one surface is in contact with the other surfaceof the second layer 23, and the second substrate 21 in contact with theother surface of the second separation layer 22 (see FIGS. 14A-1 and14A-2). Note that in this embodiment, description is given of a case ofusing the processed member 90 in which the separation starting points 13s are formed in advance in the vicinity of end portions of the bondinglayer 30 (see FIGS. 14B-1 and 14B-2). Note that a method formanufacturing the processed member 90 is described in Embodiment 5.

<<First Step>>

The processed member 90 is conveyed to the first loader unit 100. Theprocessed member 90 is fed from the first loader unit 100 to the firstseparating unit 300 by being conveyed with the conveying means 111.

<<Second Step>>

The first separating unit 300 separates the one surface 90 h of theprocessed member 90. Specifically, from the separation starting point 13s formed in the vicinity of the end portion of the bonding layer 30, thefirst substrate 11 is separated from the first layer 13 together withthe first separation layer 12 (see FIG. 14C).

Through this step, the first remaining portion 90 a can be obtained fromthe processed member 90. Specifically, the first remaining portion 90 aincludes the first layer 13, the bonding layer 30 whose one surface isin contact with the first layer 13, the second layer 23 whose onesurface is in contact with the other surface of the bonding layer 30,the second separation layer 22 whose one surface is in contact with theother surface of the second layer 23, and the second substrate 21 incontact with the other surface of the second separation layer 22.

<<Third Step>>

The conveying means 111 conveys the first remaining portion 90 a, andthe support feeding unit 500 feeds the first support 41.

The first attaching unit 400 forms the first adhesive layer 31 on thefed first remaining portion 90 a (see FIGS. 14D-1 and 14D-2), andattaches the first remaining portion 90 a and the first support 41 toeach other with the use of the first adhesive layer 31.

Through this step, the stack 91 is obtained from the first remainingportion 90 a. Specifically, the stack 91 includes the first support 41,the first adhesive layer 31, the first layer 13, the bonding layer 30whose one surface is in contact with the first layer 13, the secondlayer 23 whose one surface is in contact with the other surface of thebonding layer 30, the second separation layer 22 whose one surface is incontact with the other surface of the second layer 23, and the secondsubstrate 21 in contact with the other surface of the second separationlayer 22 (see FIGS. 14E-1 and 14E-2),

<<Fourth Step>>

The conveying means 111 conveys the stack 91, and the stack 91 is fedinto the first loader unit 100 also serving as the first unloader unit.

Through this step, the stack 91 is ready to be transported. For example,when it takes time to cure the first adhesive layer 31, the stack 91 inwhich the first adhesive layer 31 is not cured yet can be transported tocure the first adhesive layer 31 outside the stack processing apparatus1000B. Thus, occupancy time of the apparatus can be reduced.

<<Fifth Step>>

The stack 91 is conveyed to the second loader unit 600. The stack 91 isfed from the second loader unit 600 to the starting point forming unit700 by being conveyed with the conveying means 112.

<<Sixth Step>>

The starting point forming unit 700 peels part of the second layer 23 inthe vicinity of the end portion of the first adhesive layer 31 of thestack 91 from the second separation layer 22 to form the separationstarting points 91 s.

For example, the first support 41 and the first adhesive layer 31 arecut from a side where the first support 41 is provided, and part of thesecond layer 23 is separated from the second separation layer 22.

Specifically, the first adhesive layer 31 and the first support 41 in aregion which is over the second separation layer 22 and in which thesecond layer 23 is provided are cut to draw a closed curve with a bladeor the like including a sharp tip, and along the closed curve, thesecond layer 23 is partly separated from the second separation layer 22(see FIGS. 15A-1 and 15A-2).

Through this step, the separation starting points 91 s are formed in thecut portion in the vicinity of the end portions of the first support 41b and the first adhesive layer 31.

<<Seventh Step>>

The second separating unit 800 separates the second remaining portion 91a from the stack 91. Specifically, from the separation starting pointformed in the vicinity of the end portion of the first adhesive layer31, the second substrate 21 is separated from the second layer 23together with the second separation layer 22 (see FIG. 15C).

Through this step, the second remaining portion 91 a is obtained fromthe stack 91. Specifically, the second remaining portion 91 a includesthe first support 41 b, the first adhesive layer 31, the first layer 13,the bonding layer 30 whose one surface is in contact with the firstlayer 13, and the second layer 23 whose one surface is in contact withthe other surface of the bonding layer 30.

<<Eighth Step>>

The conveying means 112 conveys the second remaining portion 91 a, andturns the second remaining portion 91 a so that the second layer 23faces upward. In the second cleaning device 850, the fed secondremaining portion 91 a is cleaned.

The conveying means 112 conveys the second remaining portion 91 a, andthe support feeding unit 500 feeds the second support 42.

Note that the second remaining portion 91 a may be directly fed into thesecond attaching unit 900 without being fed into the second cleaningdevice 850.

The second attaching unit 900 forms the second adhesive layer 32 on thefed second remaining portion 91 a (see FIGS. 15D-1 and 15D-2), andattaches the second remaining portion 91 a to the second support 42 withthe use of the second adhesive layer 32 (see FIGS. 15E-1 and 15E-2).

Through this step, the stack 92 is obtained from the second remainingportion 91 a. Specifically, the stack 92 includes the first layer 13,the first support 41 h attached to one surface of the first layer 13with the use of the first adhesive layer 31, the bonding layer 30 whoseone surface is in contact with the other surface of the first layer 13,the second layer 23 whose one surface is in contact with the othersurface of the bonding layer 30, and the second support 42 attached tothe other surface of the second layer 23 with the use of the secondadhesive layer 32.

<<Ninth Step>>

The conveying means 112 conveys the stack 92, and the stack 92 is fedinto the second loader unit 600 also serving as the second unloaderunit.

Through this step, the stack 92 is ready to be transported.

Modification Example

A modification example of this embodiment is described with reference toFIG. 16.

FIG. 16 is a schematic diagram illustrating a structure of the stackprocessing apparatus 1000B that is one embodiment of the presentinvention, and the conveyance path of a processed member and a stack ina process.

In the modification example of this embodiment, a method formanufacturing the stack 92 from the processed member 90 with the use ofthe stack processing apparatus 1000B, which is different from theabove-described method, is described with reference to FIGS. 14A-1,14A-2, 14B-1, 14B-2, 14C, 14D-1, 14D-2, 14E-1, and 14E-2; FIGS. 15A-1,15A-2, 15B, 15C, 15D-1, 15D-2, 15E-1, and 15E-2; and FIG. 16.

Specifically, the differences between the method in this modificationexample and the above-described method are as follows: in the fourthstep, the conveying means 111 conveys the stack 91 and the stack 91 isfed not into the first loader unit 100 also serving as the firstunloader unit but into the second cleaning device 850; in the fifthstep, the conveying means 112 conveys the stack 91 and the stack 91 isfed into the starting point forming unit 700; and in the eighth step,the second remaining portion 91 a is directly fed into the secondattaching unit 900 without being fed into the second cleaning device850. Thus, different portions will be described in detail below. Referto the above description for portions where the same methods can beemployed.

Modification Example of Fourth Step

The conveying means 111 conveys the stack 91 and the stack 91 is fedinto the second cleaning device 850.

In the modification example of this embodiment, the second cleaningdevice 850 is used as a delivery chamber in which the conveying means111 delivers the stack 91 to the conveying means 112 (see FIG. 16).

Through this step, the stack 91 can be continuously processed withoutbeing transported from the stack processing apparatus 1000B.

Modification Example of Fifth Step

The conveying means 112 conveys the stack 91, and the stack 91 is fedinto the starting point forming unit 700.

Modification Example of Eighth Step

The conveying means 112 conveys the second remaining portion 91 a, andturns the second remaining portion 91 a so that the second layer 23faces upward. The second remaining portion 91 a is fed into the secondattaching unit 900.

The second attaching unit 900 forms the second adhesive layer 32 on thefed second remaining portion 91 a (see FIGS. 15D-1 and 15D-2), andattaches the second remaining portion 91 a to the second support 42 withthe use of the second adhesive layer 32 (see FIGS. 15E-1 and 15E-2).

Through this step, the stack 92 is obtained from the second remainingportion 91 a. Specifically, the stack 92 includes the first layer 13,the first support 41 b attached to one surface of the first layer 13with the use of the first adhesive layer 31, the bonding layer 30 whoseone surface is in contact with the other surface of the first layer 13,the second layer 23 whose one surface is in contact with the othersurface of the bonding layer 30, and the second support 42 attached tothe other surface of the second layer 23 with the use of the secondadhesive layer 32.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 5

In this embodiment, a structure of a processed member which isapplicable to the stack processing apparatus that is one embodiment ofthe present invention is described with reference to FIGS. 17A-1 and17A-2.

FIGS. 17A-1 and 17A-2 are schematic views illustrating a structure of aprocessed member that can be used to form a stack with the use of thestack processing apparatus that is one embodiment of the presentinvention.

FIG. 17A-1 is a cross-sectional view illustrating a structure of theprocessed member 90, and FIG. 17A-2 is a top view corresponding to thecross-sectional view.

<Processed Member>

The processed member 90 includes the first substrate 11, the firstseparation layer 12 on the first substrate 11, the first layer 13 whoseone surface is in contact with the first separation layer 12, thebonding layer 30 whose one surface is in contact with the other surfaceof the first layer 13, the second layer 23 whose one surface is incontact with the other surface of the bonding layer 30, the secondseparation layer 22 whose one surface is in contact with the othersurface of the second layer 23, and the second substrate 21 in contactwith the other surface of the second separation layer 22 (see FIGS.17A-1 and 17A-2).

Note that the separation starting points 13 s may be provided in thevicinity of the end portions of the bonding layer 30.

<<First Substrate>>

There is no particular limitation on the first substrate 11 as long asthe first substrate 11 has heat resistance high enough to withstand amanufacturing process and a thickness and a size which can be used in amanufacturing apparatus.

Examples of a material that can be used for the first substrate 11include glass, a ceramic, a metal, an inorganic material, and a resin.

Specifically, as the glass, non-alkali glass, soda-lime glass, potashglass, crystal glass, or the like can be given. As the metal, SUS,aluminum, or the like can be given.

The first substrate 11 may have a single-layer structure, astacked-layer structure, or the like. For example, a stacked-layerstructure including a base and an insulating layer that preventsdiffusion of impurities contained in the base may be employed.Specifically, a structure can be employed in which glass and variousbase layers that prevent diffusion of impurities contained in the glass,such as a silicon oxide layer, a silicon nitride layer, and a siliconoxynitride layer, are stacked.

<<First Separation Layer->>

There is no particular limitation on the first separation layer 12 aslong as the first separation layer 12 can be used to separate the firstlayer 13 formed thereon and has heat resistance high enough to withstandthe manufacturing process.

As a material that can be used for the first separation layer 12, aninorganic material, an organic material, or the like can be given.

Specific examples of the inorganic material include a metal, an alloy, acompound, and the like that contain any of the following elements:tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt,zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, andsilicon.

Specific examples of the organic material include polyimide, polyester,polyolefin, polyamide, polycarbonate, an acrylic resin, and the like.

The first separation layer 12 may have a single-layer structure, astacked-layer structure, or the like. For example, a stacked-layerstructure including a layer containing tungsten and a layer containingan oxide of tungsten can be employed.

The layer containing an oxide of tungsten may be formed by stackinganother layer with a layer containing tungsten; for example, the layercontaining an oxide of tungsten may be formed by stacking a filmcontaining oxygen, such as a silicon oxide film or a silicon oxynitridefilm, with a layer containing tungsten.

The layer containing an oxide of tungsten may be formed by performingthermal oxidation treatment, oxygen plasma treatment, nitrous oxide(N₂O) plasma treatment, treatment with a solution having strongoxidizing power (e.g., ozone water), or the like on a surface of a layercontaining tungsten,

<<First Layer to be Separated>>

There is no particular limitation of the fast layer 13 as long as layer13 can be separated from the first separation layer 12 and has heatresistance high enough to withstand the manufacturing process.

As a material that can be used for the first layer 13, an inorganicmaterial, an organic material, or the like can be given.

The first layer 13 may have a single-layer structure, a stacked-layerstructure, or the like. For example, a structure may be employed inwhich a functional layer overlapping with the first separation layer 12and an insulating layer that is provided between the first separationlayer 12 and the functional layer to prevent diffusion of impuritieswhich impair the characteristics of the functional layer are stacked.Specifically, a structure can be employed in which a silicon oxynitridelayer, a silicon nitride layer, and the functional layer are stacked inthis order over the first separation layer 12.

Examples of the functional layer that can be used for the first layer 13include a functional circuit, a functional element, an optical element,and a functional film; and a layer including a plurality of elementsselected from the above examples. Specific examples are a pixel circuitof a display device, a driver circuit of the display device, a displayelement, a color filter, and a moisture-proof film; and a layerincluding a plurality of elements selected from the above examples.

<<Bonding Layer>>

There is no particular limitation on the bonding layer 30 as long as thebonding layer 30 bonds the first layer 13 and the second layer 23 toeach other.

As a material that can be used for the bonding layer 30, an inorganicmaterial, an organic resin, or the like can be given.

Specifically, a glass layer with a melting point of 400° C. or lower,preferably 300° C. or lower, an adhesive, or the like can be used.

Examples of adhesive that can be used for the bonding layer 30 include alight curable adhesive such as a UV curable adhesive, a reactive curableadhesive, a heat curable adhesive, and an anaerobic adhesive.

Examples of such adhesives include an epoxy resin, an acrylic resin, asilicone resin, a phenol resin, a polyimide resin, an imide resin, apolyvinyl chloride (PVC) resin, a polyvinyl butyral (PVB) resin, and anethylene vinyl acetate (EVA) resin.

<<Separation Starting Point>>

In the processed member 90, the separation starting points 13 s may beprovided in the vicinity of the end portions of the bonding layer 30.

The separation starting points 13 s are formed by peeling part of thefirst layer 13 from the first separation layer 12 side.

The separation starting points 13 s can be formed by inserting a sharptip into the first layer 13 from the first substrate 11 side;alternatively, the separation starting points 13 s can be formed bypeeling part of the first layer 13 from the first separation layer 12 bya noncontact method using a laser or the like a laser ablation method).

<<Second Substrate>>

As the second substrate 21, the same substrate as the first substrate 11can be used. Alternatively, the second substrate 21 and the firstsubstrate 11 do not need to have the same structure.

<<Second Separation Layer>>

As the second separation layer 22, the same layer as the firstseparation layer 12 can be used. Alternatively, the second separationlayer 22 and the first separation layer 12 do not need to have the samestructure.

<<Second Layer to be Separated>>

The second layer 23 can have the same structure as the first layer 13.Alternatively, the second layer 23 can have a structure different fromthat of the first layer 13.

For example, a structure may be employed in which the first layer 13includes a functional circuit and the second layer 23 includes afunctional layer that prevents diffusion of impurities into thefunctional circuit.

Specifically, a structure may be employed in which the first layer 13includes a pixel circuit of a display device, a driver circuit of thedisplay device, and a light-emitting element that is connected to thepixel circuit and emits light to the second layer, and the second layer23 includes a color filter and a moisture-proof film.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 6

In this embodiment, description is given of an example of a flexiblelight-emitting device (light-emitting panel) that can be manufacturedwith the use of any of the stack processing apparatuses described inEmbodiments 1 to 4.

Specific Example 1

FIG. 18A is a plan view of a flexible light-emitting panel, and FIG. 18Bis an example of a cross-sectional view taken along dashed-dotted lineG1-G2 in FIG. 18A. In addition, examples of another cross-sectional vieware illustrated in FIGS. 22A and 22B.

The light-emitting panel illustrated in FIG. 18B includes an elementlayer 1301, an adhesive layer 1305, and a substrate 1303. The elementlayer 1301 includes a substrate 1401, an adhesive layer 1403, aninsulating layer 1405, a transistor 1440, a conductive layer 1357, aninsulating layer 1407, an insulating layer 1409, a light-emittingelement 1430, an insulating layer 1411, a sealing layer 1413, aninsulating layer 1461, a coloring layer 1459, a light-blocking layer1457, and an insulating layer 1455.

The conductive layer 1357 is electrically connected to an FPC 1308 via aconnector 1415.

The light-emitting element 1430 includes a lower electrode 1431, an ELlayer 1433, and an upper electrode 1435. The lower electrode 1431 iselectrically connected to a source electrode or a drain electrode of thetransistor 1440. An end portion of the lower electrode 1431 is coveredwith the insulating layer 1411. The light-emitting element 1430 has atop emission structure. The upper electrode 1435 has alight-transmitting property and transmits light emitted from the ELlayer 1433.

Note that as illustrated in FIG. 223, with the use of an EL layer 1433Aand an EL layer 1433B, the EL layers may be separately provided for eachpixel. In this case, different colors are emitted in the pixels;therefore, the coloring layer 1459 is not necessarily provided.

The coloring layer 1459 is provided to overlap with the light-emittingelement 1430, and the light-blocking layer 1457 is provided to overlapwith the insulating layer 1411. The coloring layer 1459 and thelight-blocking layer 1457 are covered with the insulating layer 1461. Aspace between the light-emitting element 1430 and the insulating layer1461 is filled with the sealing layer 1413.

The light-emitting panel includes a plurality of transistors in a lightextraction portion 1304 and a driver circuit portion 1306. Thetransistor 1440 is provided over the insulating layer 1405. Theinsulating layer 1405 and the substrate 1401 are attached to each otherwith the adhesive layer 1403. The insulating layer 1455 and thesubstrate 1303 are attached to each other with the adhesive layer 1305.It is preferable to use films with low water permeability for theinsulating layer 1405 and the insulating layer 1455, in which case animpurity such as water can be prevented from entering the light-emittingelement 1430 or the transistor 1440, leading to improved reliability ofthe light-emitting panel. The adhesive layer 1403 can be formed using amaterial similar to that of the adhesive layer 1305.

The light-emitting panel in Specific Example 1 can be manufactured inthe following manner: the insulating layer 1405, the transistor 1440,and the light-emitting element 1430 are formed over a formationsubstrate with high heat resistance; the formation substrate isseparated; and the insulating layer 1405, the transistor 1440, and thelight-emitting element 1430 are transferred to the substrate 1401 andattached thereto with the adhesive layer 1403. The light-emitting panelin Specific Example 1 can be manufactured in the following manner: theinsulating layer 1455, the coloring layer 1459, and the light-blockinglayer 1457 are formed over a formation substrate with high heatresistance; the formation substrate is separated; and the insulatinglayer 1455, the coloring layer 1459, and the light-blocking layer 1457are transferred to the substrate 1303 and attached thereto with theadhesive layer 1305.

In the case where a material with high water permeability and low heatresistance resin) is used for a substrate, it is impossible to exposethe substrate to high temperature in the manufacturing process. Thus,there is a limitation on conditions for forming a transistor and aninsulating film over the substrate. In the manufacturing method of thisembodiment, a transistor and the like can be formed over a formationsubstrate having high heat resistance; thus, a highly reliabletransistor and an insulating film with sufficiently low waterpermeability can be formed. Then, the transistor and the insulating filmare transferred to the substrate 1303 or the substrate 1401, whereby ahighly reliable light-emitting panel can be manufactured. Thus, with oneembodiment of the present invention, a thin or/and lightweightlight-emitting device with high reliability can be provided. Details ofthe manufacturing method will be described later.

The substrate 1303 and the substrate 1401 are each preferably formedusing a material with high toughness. Thus, a display device with highimpact resistance that is less likely to be broken can be provided. Forexample, when the substrate 1303 is an organic resin substrate and thesubstrate 1401 is a substrate formed using a thin metal material or athin alloy material, a light-emitting panel that is more lightweight andless likely to be broken as compared with the case where a glasssubstrate is used can be provided.

A metal material and an alloy material, which have high thermalconductivity, are preferred because they can easily conduct heat to thewhole substrate and accordingly can prevent a local temperature rise inthe light-emitting panel. The thickness of a substrate using a metalmaterial or an alloy material is preferably greater than or equal to 10μm and less than or equal to 200 μm, further preferably greater than orequal to 20 μm and less than or equal to 50 μm.

Further, when a material with high thermal emissivity is used for thesubstrate 1401, the surface temperature of the light-emitting panel canbe prevented from rising, leading to prevention of breakage or adecrease in reliability of the light-emitting panel. For example, thesubstrate 1401 may have a stacked-layer structure of a metal substrateand a layer with high thermal emissivity (the layer can be formed usinga metal oxide or a ceramic material, for example).

Specific Example 2

FIG. 19A illustrates another example of the light extraction portion1304 in the light-emitting panel.

The light extraction portion 1304 illustrated in FIG. 19A includes thesubstrate 1303, the adhesive layer 1305, a substrate 1402, theinsulating layer 1405, the transistor 1440, the insulating layer 1407, aconductive layer 1408, an insulating layer 1409 a, an insulating layer1409 h, the light-emitting element 1430, the insulating layer 1411, thesealing layer 1413, and the coloring layer 1459.

The light-emitting element 1430 includes the lower electrode 1431, theEL layer 1433, and the upper electrode 1435. The lower electrode 1431 iselectrically connected to the source electrode or the drain electrode ofthe transistor 1440 via the conductive layer 1408. An end portion of thelower electrode 1431 is covered with the insulating layer 1411. Thelight-emitting element 1430 has a bottom emission structure. The lowerelectrode 1431 has a light-transmitting property and transmits lightemitted from the EL layer 1433.

The coloring layer 1459 is provided to overlap with the light-emittingelement 1430, and light emitted from the light-emitting element 1430 isextracted from the substrate 1303 side through the coloring layer 1459.A space between the light-emitting element 1430 and the substrate 1402is filled with the sealing layer 1413. The substrate 1402 can be formedusing a material similar to that of the substrate 1401.

Specific Example 3

FIG. 19B illustrates another example of the light-emitting panel. Thelight-emitting panel illustrated in FIG. 19B includes the element layer1301, the adhesive layer 1305, and the substrate 1303. The element layer1301 includes the substrate 1402, the insulating layer 1405, aconductive layer 1510 a, a conductive layer 1510 b, a plurality oflight-emitting elements, the insulating layer 1411, a conductive layer1412, and the sealing layer 1413.

The conductive layer 1510 a and the conductive layer 1510 b, which areexternal connection electrodes of the light-emitting panel, can each beelectrically connected to an FPC or the like.

The light-emitting element 1430 includes the lower electrode 1431, theEL layer 1433, and the upper electrode 1435. An end portion of the lowerelectrode 1431 is covered with the insulating layer 1411. Thelight-emitting element 1430 has a bottom emission structure. The lowerelectrode 1431 has a light-transmitting property and transmits lightemitted from the EL layer 1433. The conductive layer 1412 iselectrically connected to the lower electrode 1431.

The substrate 1303 may have, as a light extraction structure, ahemispherical lens, a micro lens array, a film provided with an unevensurface structure, a light diffusing film, or the like. For example,alight extraction structure can be formed by attaching the above lens orfilm to a resin substrate with an adhesive or the like havingsubstantially the same refractive index as the substrate or the lens orfilm.

The conductive layer 1412 is preferably, though not necessarily,provided because voltage drop due to the resistance of the lowerelectrode 1431 can be inhibited. In addition, for a similar purpose, aconductive layer electrically connected to the upper electrode 1435 maybe provided over the insulating layer 1411.

The conductive layer 1412 can be a single layer or a stacked layerformed using a material selected from copper, titanium, tantalum,tungsten, molybdenum, chromium, neodymium, scandium, nickel, oraluminum, an alloy material containing any of these materials as itsmain component, or the like. The thickness of the conductive layer 1412can be greater than or equal to 0.1 μm and less than or equal to 3 μm,preferably greater than or equal to 0.1 μm and less than or equal to 0.5μm.

When a paste (e.g., silver paste) is used as a material for theconductive layer electrically connected to the upper electrode 1435,metal particles forming the conductive layer aggregate; therefore, thesurface of the conductive layer is rough and has many gaps. Thus, it isdifficult for the EL layer 1433 to completely cover the conductivelayer; accordingly, the upper electrode and the conductive layer areelectrically connected to each other easily, which is preferable.

Examples of Materials

Next, materials and the like that can be used for the light-emittingpanel are described. Note that description of the components alreadydescribed in this embodiment is omitted.

The element layer 1301 includes at least a light-emitting element. Asthe light-emitting element, a self-luminous element can be used, and anelement whose luminance is controlled by current or voltage is includedin the category of the t-emitting element. For example, a light-emittingdiode (LED), an organic EL element, an inorganic EL element, or the likecan be used.

The element layer 1301 may further include a transistor for driving thelight-emitting element, a touch sensor, or the like.

The structure of the transistors in the light-emitting panel is notparticularly limited. For example, a forward staggered transistor or aninverted staggered transistor may be used. A top-gate transistor or abottom-gate transistor may be used. A semiconductor material used forthe transistors is not particularly limited, and for example, silicon orgermanium can be used. Alternatively, an oxide semiconductor containingat least one of indium, gallium, and zinc, such as an In—Ga—Zn-basedmetal oxide, may be used.

There is no particular limitation on the state of a semiconductormaterial used for the transistors, and an amorphous semiconductor or asemiconductor having crystallinity (a microcrystalline semiconductor, apolycrystalline semiconductor, a single-crystal semiconductor, or asemiconductor partly including crystal regions) may 2) be used. It ispreferable that a semiconductor having crystallinity be particularlyused, in which case deterioration of the transistor characteristics canbe suppressed.

The light-emitting element included in the light-emitting panel includesa pair of electrodes (the lower electrode 1431 and the upper electrode1435); and the EL layer 1433 between the pair of electrodes. One of thepair of electrodes functions as an anode and the other functions as acathode.

The light-emitting element may have any of a top emission structure, abottom emission structure, and a dual emission structure. A conductivefilm that transmits visible light is used as the electrode through whichlight is extracted. A conductive film that reflects visible light ispreferably used as the electrode through which light is not extracted.

The conductive film that transmits visible light can be formed using,for example, indium oxide, indium tin oxide (ITO), indium zinc oxide,zinc oxide, or zinc oxide to which gallium is added. Alternatively, afilm of a metal material such as gold, silver, platinum, magnesium,nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium,or titanium; an alloy containing any of these metal materials; or anitride of any of these metal materials (e.g., titanium nitride) can beformed thin so as to have a light-transmitting property. Alternatively,a stack of any of the above materials can be used as the conductivefilm. For example, a stacked film of ITO and an alloy of silver andmagnesium is preferably used, in which case conductivity can beincreased. Further alternatively, graphene or the like may be used.

For the conductive film that reflects visible light, for example, ametal material such as aluminum, gold, platinum, silver, nickel,tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium or analloy containing any of these metal materials can be used. Lanthanum,neodymium, germanium, or the like may be added to the metal material orthe alloy. An alloy containing aluminum (an aluminum alloy) such as analloy of aluminum and titanium, an alloy of aluminum and nickel, or analloy of aluminum and neodymium; or an alloy containing silver such asan alloy of silver and copper, an alloy of silver, palladium, and,copper or an alloy of silver and magnesium can be used for theconductive film. An alloy of silver and copper is preferable because ofits high heat resistance. Furthermore, when a metal film or a metaloxide film is stacked in contact with an aluminum alloy film, oxidationof the aluminum alloy film can be inhibited. Examples of a material forthe metal film or the metal oxide film are titanium and titanium oxide.Alternatively, the above conductive film that transmits visible lightand a film containing a metal material may be stacked. For example, astacked film of silver and ITO or a stacked film of an alloy of silverand magnesium and ITO can be used.

Each of the electrodes can be formed by an evaporation method or asputtering method. Alternatively, a discharging method such as an inkjetmethod, a printing method such as a screen printing method, or a platingmethod may be used.

When a voltage higher than the threshold voltage of the light-emittingelement is applied between the lower electrode 1431 and the upperelectrode 1435, holes are injected to the EL layer 1433 from the anodeside and electrons are injected to the EL layer 1433 from the cathodeside. The injected electrons and holes are recombined in the EL layer1433 and a light-emitting substance contained in the EL layer 1433 emitslight.

The EL layer 1433 includes at least a light-emitting layer. In additionto the light-emitting layer, the EL layer 1433 may further include oneor more layers containing any of a substance with a high hole-injectionproperty, a substance with a high hole-transport property, ahole-blocking material, a substance with a high electron-transportproperty, a substance with a high electron-injection property, asubstance with a bipolar property (a substance with a highelectron-transport property and a hole-transport property), and thelike.

For the EL layer 1433, either a low molecular compound or a highmolecular compound can be used, and an inorganic compound may also beused. Each of the layers included in the EL layer 1433 can be formed byany of the following methods: an evaporation method (including a vacuumevaporation method), a transfer method, a printing method, an inkjetmethod, a coating method, and the like.

In the element layer 1301, the light-emitting element is preferablyprovided between a pair of insulating films with low water permeability.Thus, an impurity such as water can be inhibited from entering thelight-emitting element, leading to inhibition of a decrease in thereliability of the light-emitting device.

As an insulating film with low water permeability, a film containingnitrogen and silicon (e.g., a silicon nitride film or a silicon nitrideoxide film), a film containing nitrogen and aluminum (e.g., an aluminumnitride film), or the like can be used. Alternatively, a silicon oxidefilm, a silicon oxynitride film, an aluminum oxide film, or the like canbe used.

For example, the water vapor transmittance of the insulating film withlow water permeability is lower than or equal to 1×10⁻⁵ [g/m²·day],preferably lower than or equal to 1×10⁻⁶ [g/m²·day], further preferablylower than or equal to 1×10⁻⁷ [g/m²·day], still further preferably lowerthan or equal to 1×10⁻⁵ [g/m²·day].

The substrate 1303 has a light-transmitting property and transmits atleast light emitted from the light-emitting element included in theelement layer 1301. The substrate 1303 has flexibility. The refractiveindex of the substrate 1303 is higher than that of the air.

An organic resin, which has a specific gravity smaller than that ofglass, is preferably used for the substrate 1303, in which case thelight-emitting device can be more lightweight as compared with the casewhere glass is used.

Examples of a material having flexibility and a light-transmittingproperty with respect to visible light include glass that is thin enoughto have flexibility, polyester resins such as polyethylene terephthalate(PET) and polyethylene naphthalate (PEN), a polyacrylonitrile resin, apolyimide resin, a polymethyl methacrylate resin, a polycarbonate (PC)resin, a polyethersulfone (PES) resin, a polyamide resin, a cycloolefinresin, a polystyrene resin, a polyamide imide resin, and a polyvinylchloride resin. In particular, a material whose thermal expansioncoefficient is low is preferred, and for example, a polyamide imideresin, a polyimide resin, or PET can be suitably used. A substrate inwhich a glass fiber is impregnated with an organic resin or a substratewhose thermal expansion coefficient is reduced by mixing an organicresin with an inorganic filler can also be used.

The substrate 1303 may have a stacked-layer structure of a layer of anyof the above-described materials and a hard coat layer (e.g., a siliconnitride layer) which protects a surface of the light-emitting devicefrom damage or the like, a layer (e.g., an aramid resin layer) which candisperse pressure, or the like. Furthermore, to suppress a decrease inthe lifetime of the light-emitting element due to moisture and the like,the insulating film with low water permeability may be included in thestacked structure.

The adhesive layer 1305 has a light-transmitting property and transmitsat least light emitted from the light-emitting element included in theelement layer 1301. The refractive index of the adhesive layer 1305 ishigher than that of the air.

For the adhesive layer 1305, a resin that is curable at room temperature(e.g., a two-component-mixture-type resin), a light curable resin, athermosetting resin, or the like can be used. Examples of such resinsinclude an epoxy resin, an acrylic resin, a silicone resin, and a phenolresin. In particular, a material with low moisture permeability, such asan epoxy resin, is preferred.

The resin may include a drying agent. For example, a substance thatadsorbs moisture by chemical adsorption, such as oxide of an alkalineearth metal (e.g., calcium oxide or barium oxide), can be used.Alternatively, a substance that adsorbs moisture by physical adsorption,such as zeolite or silica gel, may be used. The drying agent ispreferably included because it can inhibit an impurity such as moisturefrom entering the light-emitting element, thereby improving thereliability of the light-emitting device.

In addition, it is preferable to mix a filler with a high refractiveindex (e.g., titanium oxide) into the resin, in which case theefficiency of light extraction from the light-emitting element can beimproved.

The adhesive layer 1305 may also include a scattering member forscattering light. For example, the adhesive layer 1305 can be a mixtureof the above-described resin and particles having refractive indexdifferent from that of the resin. The particles function as thescattering member for scattering light.

The difference in refractive index between the resin and the particleswith a refractive index different from that of the resin is preferably0.1 or more, further preferably 0.3 or more. Specifically, an epoxyresin, an acrylic resin, an imide resin, a silicone resin, or the likecan be used as the resin, and titanium oxide, barium oxide, zeolite, orthe like can be used as the particles.

Particles of titanium oxide or barium oxide are preferable because theyscatter light excellently. When zeolite is used, it can adsorb watercontained in the resin and the like, thereby improving the reliabilityof the light-emitting element.

The insulating layer 1405 and the insulating layer 1455 can each beformed using an inorganic insulating material. It is particularlypreferable to use the insulating film with low water permeability, inwhich case a highly reliable light-emitting panel can be provided.

The insulating layer 1407 has an effect of inhibiting diffusion ofimpurities into a semiconductor included in the transistor. As theinsulating layer 1407, an inorganic insulating film such as a siliconoxide film, a silicon oxynitride film, or an aluminum oxide film can beused.

As each of the insulating layers 1409, 1409 a, and 1409 b, an insulatingfilm with a planarization function is preferably selected in order toreduce surface unevenness due to the transistor or the like. Forexample, an organic material such as a polyimide resin, an acrylicresin, or a benzocyclobutene-based resin can be used. Other than suchorganic materials, it is also possible to use a low-dielectric constantmaterial to low-k material) or the like. Note that a plurality ofinsulating films formed of these materials or inorganic insulating filmsmay be stacked.

The insulating layer 1411 is provided to cover an end portion of thelower electrode 1431. In order that the insulating layer 1411 befavorably covered with the EL layer 1433 and the upper electrode 1435formed thereover, a side wall of the insulating layer 1411 preferablyhas a tilted surface with continuous curvature.

As a material for the insulating layer 1411, a resin or an inorganicinsulating material can be used. As the resin, for example, a polyimideresin, a polyamide resin, an acrylic resin, a siloxane resin, an epoxyresin, or a phenol resin can be used. In particular, either a negativephotosensitive resin or a positive photosensitive resin is preferablyused for easy formation of the insulating layer 1411.

There is no particular limitation on the method for forming theinsulating layer 1411; a photolithography method, a sputtering method,an evaporation method, a droplet discharging method (e.g., an inkjetmethod), a printing method (e.g., a screen printing method or an off-setprinting method), or the like may be used.

For the sealing layer 1413, a resin that is curable at room temperature(e.g., a two-component-mixture-type resin), a light curable resin, athermosetting resin, or the like can be used. For example, a polyvinylchloride (PVC) resin, an acrylic resin, a polyimide resin, an epoxyresin, a silicone resin, a polyvinyl butyral (PVB) resin, an ethylenevinyl acetate (EVA) resin, or the like can be used. A drying agent maybe contained in the sealing layer 1413. In the case where light emittedfrom the light-emitting element 1430 is extracted outside through thesealing layer 1413, the sealing layer 1413 preferably includes a fillerwith a high refractive index or a scattering member. Materials for thedrying agent, the filler with a high refractive index, and thescattering member are similar to those that can be used for the adhesivelayer 1305.

The conductive layer 1357 can be formed using the same material and thesame step as a conductive layer included in the transistor or thelight-emitting element. For example, the conductive layer can be formedto have a single-layer structure or a stacked-layer structure using anyof metal materials such as molybdenum, titanium, chromium, tantalum,tungsten, aluminum, copper, neodymium, and scandium, and an alloymaterial containing any of these elements. Each of the conductive layersmay be formed using a conductive metal oxide. As the conductive metaloxide, indium oxide (e.g., In₂O₃), tin oxide (e.g., SnO₂), zinc oxide(ZnO), ITO, indium zinc oxide (e.g., In₂O₃—ZnO), or any of these metaloxide materials in which silicon oxide is contained can be used.

Each of the conductive layers 1408, 1412, 1510 a, and 1510 b can also beformed using any of the above-described metal materials, alloymaterials, and conductive metal oxides.

For the connector 1415, it is possible to use a paste-like or sheet-likematerial which is obtained by mixture of metal particles and athermosetting resin and for which anisotropic electric conductivity isprovided by thermocompression bonding. As the metal particles, particlesin which two or more kinds of metals are layered, for example, nickelparticles coated with gold are preferably used.

The coloring layer 1459 is a colored layer that transmits light in aspecific wavelength range. For example, a red (R) color filter fortransmitting light in a red wavelength range, a green (G) color filterfor transmitting light in a green wavelength range, a blue (B) colorfilter for transmitting light in a blue wavelength range, or the likecan be used. Each coloring layer is formed in a desired position withany of various materials by a printing method, an inkjet method, anetching method using a photolithography method, or the like.

The light-blocking layer 1457 is provided between the adjacent coloringlayers 1459. The light-blocking layer 1457 blocks light emitted from theadjacent light-emitting element, thereby inhibiting color mixturebetween adjacent pixels. Here, the coloring layer 1459 is provided suchthat its end portion overlaps with the light-blocking layer 1457,whereby light leakage can be reduced. The light-blocking layer 1457 canbe formed using a material that blocks light emitted from thelight-emitting element, for example, a metal material, a resin materialincluding a pigment or a dye, or the like. Note that the light-blockinglayer 1457 is preferably provided in a region other than the lightextraction portion 1304, such as the driver circuit portion 1306, asillustrated in FIG. 18B, in which case undesired leakage of guided lightor the like can be inhibited.

The insulating layer 1461 covering the coloring layer 1459 and thelight-blocking layer 1457 is preferably provided because it can inhibitan impurity such as a pigment included in the coloring layer 1459 or thelight-blocking layer 1457 from diffusing into the light-emitting elementor the like. For the insulating layer 1461, a light-transmittingmaterial is used, and an inorganic insulating material or an organicinsulating material can be used. The insulating film with low waterpermeability may be used for the insulating layer 1461.

Manufacturing Method Example

Next, an example of a method for manufacturing a light-emitting devicewill be described with reference to FIGS. 20A to 20C and FIGS. 21A to21C. Here, the manufacturing method is described using thelight-emitting device of Specific Example 1 (FIG. 18B) as an example.

First, a separation layer 1503 is formed over a formation substrate1501, and the insulating layer 1405 is formed over the separation layer1503. Next, the transistor 1440, the conductive layer 1357, theinsulating layer 1407, the insulating layer 1409, the light-emittingelement 1430, and the insulating layer 1411 are formed over theinsulating layer 1405. An opening is formed in the insulating layers1411, 1409, and 1407 to expose the conductive layer 1357 (see FIG. 20A).

In addition, a separation layer 1507 is formed over a formationsubstrate 1505, and the insulating layer 1455 is formed over theseparation layer 1507. Next, the light-blocking layer 1457, the coloringlayer 1459, and the insulating layer 1461 are formed over the insulatinglayer 1455 (see FIG. 2013).

Here, the formation substrate 1501 corresponds to one of the substrate210 and the substrate 220 in Embodiment 1, and the formation substrate1505 corresponds to the other of the substrate 210 and the substrate220.

The formation substrate 1501 and the formation substrate 1505 can eachbe a glass substrate, a quartz substrate, a sapphire substrate, aceramic substrate, a metal substrate, or the like.

For the glass substrate, for example, a glass material such asaluminosilicate glass, aluminoborosilicate glass, or barium borosilicateglass can be used. When the temperature of heat treatment performedlater is high, a substrate having a strain point of 730° C. or higher ispreferably used. Alternatively, crystallized glass or the like may beused.

In the case where a glass substrate is used as the formation substrate,an insulating film such as a silicon oxide film, a silicon oxynitridefilm, a silicon nitride film, or a silicon nitride oxide film ispreferably formed between the formation substrate and the separationlayer, in which case contamination from the glass substrate can beprevented.

The separation layer 1503 and the separation layer 1507 each have asingle-layer structure or a stacked-layer structure containing anelement selected from tungsten, molybdenum, titanium, tantalum, niobium,nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium,iridium, and silicon; an alloy material containing any of the elements;or a compound material containing any of the elements. A crystalstructure of a layer containing silicon may be amorphous, microcrystal,or polycrystal.

The separation layer can be formed by a sputtering method, a plasma CVDmethod, a coating method, a printing method, or the like. Note that acoating method includes a spin coating method, a droplet dischargemethod, and a dispensing method.

In the case where the separation layer has a single-layer structure, atungsten layer, a molybdenum layer, or a layer containing a mixture oftungsten and molybdenum is preferably formed. Alternatively, a layercontaining an oxide or an oxynitride of tungsten, a layer containing anoxide or an oxynitride of molybdenum, or a layer containing an oxide oran oxynitride of a mixture of tungsten and molybdenum may be formed.Note that the mixture of tungsten and molybdenum corresponds to an alloyof tungsten and molybdenum, for example.

In the case where the separation layer is formed to have a stacked-layerstructure including a layer containing tungsten and a layer containingan oxide of tungsten, the layer containing an oxide of tungsten may beformed as follows: the layer containing tungsten is formed first and aninsulating film formed of an oxide is formed thereover, so that thelayer containing an oxide of tungsten is formed at the interface betweenthe tungsten layer and the insulating film. Alternatively, the layercontaining an oxide of tungsten may be formed by performing thermaloxidation treatment, oxygen plasma treatment, nitrous oxide (N₂O) plasmatreatment, treatment with a highly oxidizing solution such as ozonewater, or the like on the surface of the layer containing tungsten.Plasma treatment or heat treatment may be performed in an atmosphere ofoxygen, nitrogen, or nitrous oxide alone, or a mixed gas of any of thesegasses and another gas. Surface condition of the separation layer ischanged by the plasma treatment or heat treatment, whereby adhesionbetween the separation layer and the insulating layer formed later canbe controlled.

Each of the insulating layers can be formed by a sputtering method, aplasma CVD method, a coating method, a printing method, or the like. Forexample, the insulating layer is formed at higher than or equal to 250°C. and lower than or equal to 400° C. by a plasma CVD method, wherebythe insulating layer can be a dense film with very low waterpermeability.

Then, a material for the sealing layer 1413 is applied to a surface ofthe formation substrate 1505 over which the coloring layer 1459 and thelike are formed or a surface of the formation substrate 1501 over whichthe light-emitting element 1430 and the like are formed, and theformation substrate 1501 and the formation substrate 1505 are attachedto each other with the sealing layer 1413 positioned therebetween (seeFIG. 20C).

Next, the formation substrate 1501 is separated, and the exposedinsulating layer 1405 and the substrate 1401 are attached to each otherwith the adhesion layer 1403. Furthermore, the formation substrate 1505is separated, and the exposed insulating layer 1455 and the substrate1303 are attached to each other with the adhesive layer 1305. Althoughthe substrate 1303 does not overlap with the conductive layer 1357 inFIG. 21A, the substrate 1303 may overlap with the conductive layer 1357.

The separation step of the formation substrate 1501 or the formationsubstrate 1505 can be performed with the stack processing apparatusdescribed in Embodiment 1. In addition, the step of separating theformation substrate 1501, the step of attaching the substrate 1401, thestep of separating the formation substrate 1505, and the step ofattaching the substrate 1303 can be performed with any of the stackprocessing apparatuses described in Embodiments 2 to 4.

Note that in the separation step using any of the stack processingapparatuses that are embodiments of the present invention, variousseparation methods can be performed on the formation substrate. Forexample, when a layer including a metal oxide film is formed as theseparation layer on the side in contact with the layer to be separated,the metal oxide film is embrittled by crystalization, whereby the layerto be separated can be separated from the formation substrate.Alternatively, when an amorphous silicon film containing hydrogen isformed as the separation layer between the formation substrate havinghigh heat resistance and the layer to be separated, the amorphoussilicon film is removed by laser light irradiation or etching, wherebythe layer to be separated can be separated from the formation substrate.Alternatively, after a layer including a metal oxide film is formed asthe separation layer on the side in contact with the layer to beseparated, the metal oxide film is embrittled by crystallization, andpart of the separation layer is removed by etching using a solution or afluoride gas such as NF₃, BrF₃, or ClF₃, whereby the separation can beperformed at the embrittled metal oxide film. Furthermore, a method maybe used in which a film containing nitrogen, oxygen, hydrogen, or thelike (for example, an amorphous silicon film containing hydrogen, analloy film containing hydrogen, an alloy film containing oxygen, or thelike) is used as the separation layer, and the separation layer isirradiated with laser light to release the nitrogen, oxygen, or hydrogencontained in the separation layer as a gas, thereby promoting separationbetween the layer to be separated and the formation substrate.Alternatively, it is possible to use a method in which the formationsubstrate provided with the layer to be separated is removedmechanically or by etching using a solution or a fluoride gas such asNF₃, BrF₃, or ClF₃, or the like. In this case, the separation layer isnot necessarily provided.

Furthermore, the separation step can be conducted easily by combinationof the above-described separation methods. In other words, separationcan be performed with physical force (by a machine or the like) afterperforming laser light irradiation, etching on the separation layer witha gas, a solution, or the like, or mechanical removal with a sharpknife, scalpel or the like so that the separation layer and the layer tobe separated can be easily separated from each other. The stepcorresponds to the step of forming the separation starting point in thisspecification. The separation starting point is preferably formed ineach of the processed member and the stack which are processed with anyof the stack processing apparatuses that are embodiments of the presentinvention.

Separation of the layer to be separated from the formation substrate maybe carried out by filling the interface between the separation layer andthe layer to be separated with a liquid. Furthermore, the separation maybe conducted while pouring a liquid such as water.

As another separation method, in the case where the separation layer isformed using tungsten, it is preferable that the separation be performedwhile etching the separation layer using a mixed solution of ammoniumwater and a hydrogen peroxide solution.

Note that the separation layer is not necessary in the case whereseparation at the interface between the formation substrate and thelayer to be separated is possible. For example, glass is used as theformation substrate, an organic resin such as polyimide is formed incontact with the glass, and an insulating film, a transistor, and thelike are formed over the organic resin. In this case, heating theorganic resin enables the separation at the interface between theformation substrate and the organic resin. Alternatively, separation atthe interface between a metal layer and the organic resin may beperformed in the following manner: the metal layer is provided betweenthe formation substrate and the organic resin and current is made toflow in the metal layer so that the metal layer is heated.

Lastly, an opening is formed in the insulating layer 1455 and thesealing layer 1413 to expose the conductive layer 1357 (see FIG. 21B).In the case where the substrate 1303 overlaps with the conductive layer1357, the opening is formed also in the substrate 1303 and the adhesivelayer 1305 (see FIG. 21C). The method for forming the opening is notparticularly limited and may be, for example, a laser ablation method,an etching method, an ion beam sputtering method, or the like. Asanother method, a slit may be made in a film over the conductive layer1357 with a sharp knife or the like and part of the film may beseparated by physical force.

In the above-described manner, the light-emitting panel can bemanufactured.

Note that a touch sensor or a touch panel may be provided. For example,FIG. 23 illustrates a case where a touch panel 9999 is provided in thelight-emitting panel in FIG. 22A. A touch sensor may be directly formedon the substrate 1303; alternatively, the touch panel 9999 formed onanother substrate may be placed over the substrate 1303.

Note that although the case where the light-emitting element is used asa display element is illustrated here, one embodiment of the presentinvention is not limited thereto. Various display elements can be used.For example, in this specification and the like, a display element, adisplay device which is a device including a display element, alight-emitting element, and a light-emitting device which is a deviceincluding a light-emitting element can employ a variety of modes or caninclude a variety of elements. Examples of a display element, a displaydevice, a light-emitting element, or a light-emitting device include anEL (electroluminescent) element (e.g., an EL element including organicand inorganic materials, an organic EL element, or an inorganic ELelement), an LED (e.g., a white LED, a red LED, a green LED, or a blueLED), a transistor (a transistor which emits light depending oncurrent), an electron emitter, a liquid crystal element, electronic ink,an electrophoretic element, a grating light valve (GLV), a plasmadisplay panel (PDP), a micro electro mechanical system (MEMS), a digitalmicromirror device (DMD), a digital micro shutter (DMS), MIRASOL(registered trademark), an interferometric modulator display (IMOD)element, an electrowetting element, a piezoelectric ceramic display, ora carbon nanotube, which are display media whose contrast, luminance,reflectivity, transmittance, or the like is changed by electromagneticaction. Examples of display devices having EL elements include an ELdisplay. Examples of a display device including an electron emitterinclude a field emission display (FED), an SED-type flat panel display(SED: surface-conduction electron-emitter display), and the like.Examples of display devices including liquid crystal elements include aliquid crystal display (e.g., a transmissive liquid crystal display, atransflective liquid crystal display, a reflective liquid crystaldisplay, a direct-view liquid crystal display, or a projection liquidcrystal display). Display devices having electronic ink orelectrophoretic elements include electronic paper and the like.

In this specification and the like, an active matrix method in which anactive element is included in a pixel or a passive matrix method inwhich an active element is not included in a pixel can be used.

In an active matrix method, as an active element (a non-linear element),not only a transistor but also various active elements (non-linearelements) can be used. For example, a metal insulator metal (MIM), athin film diode (TFD), or the like can also be used. Since such anelement has few number of manufacturing steps, manufacturing cost can bereduced or yield can be improved. Alternatively, since the size of theelement is small, the aperture ratio can be improved, so that powerconsumption can be reduced or higher luminance can be achieved.

As a method other than the active matrix method, the passive matrixmethod in which an active element (a non-linear element) is not used canalso be used. Since an active element (a non-linear element) is notused, the number of manufacturing steps is small, so that manufacturingcost can be reduced or the yield can be improved. Alternatively, sincean active element (a non-linear element) is not used, the aperture ratiocan be improved, so that power consumption can be reduced or higherluminance can be achieved, for example.

As described above, a light-emitting panel of this embodiment includestwo substrates; one is the substrate 1303 and the other is the substrate1401. The light-emitting device can be formed with two substrates evenwhen including a touch sensor. Owing to the use of the minimum number ofsubstrates, improvement in light extraction efficiency and improvementin clarity of display can be easily achieved.

As examples of electronic devices including a display device withflexibility, the following can be given: television devices (alsoreferred to as televisions or television receivers), monitors ofcomputers or the like cameras such as digital cameras or digital videocameras, digital photo frames, mobile phones (also referred to as mobilephones or mobile phone devices), portable game machines, portableinformation terminals, audio reproducing devices, large game machinessuch as pachinko machines, and the like.

In addition, a lighting device or a display device can be incorporatedalong a curved inside/outside wall surface of a house or a building or acurved interior/exterior surface of a car.

FIG. 24A illustrates an example of a mobile phone. A mobile phone 7400is provided with a display portion 7402 incorporated in a housing 7401,an operation button 7403, an external connection port 7404, a speaker7405, a microphone 7406, and the like. The mobile phone 7400 isfabricated using the display device for the display portion 7402.

When the display portion 7402 of the mobile phone 7400 illustrated inFIG. 24A is touched with a finger or the like, data can be input intothe mobile phone 7400. Operations such as making a call and inputting aletter can be performed by touch on the display portion 7402 with afinger or the like.

With the operation button 7403, power ON or OFF can be switched. Inaddition, types of images displayed on the display portion 7402 can beswitched; for example, switching images from a mail creation screen to amain menu screen is performed with the operation button 7403.

Here, the display portion 7402 includes a display device that can befabricated by using one embodiment of the present invention. Thus, themobile phone can have a curved display portion and high reliability.

FIG. 24B is an example of a wristband-type display device. A portabledisplay device 7100 includes a housing 7101, a display portion 7102, anoperation button 7103, and a sending and receiving device 7104.

The portable display device 7100 can receive a video signal with thesending and receiving device 7104 and can display the received video onthe display portion 7102. In addition, with the sending and receivingdevice 7104, the portable display device 7100 can send an audio signalto another receiving device.

With the operation button 7103, power ON/OFF, switching displayedvideos, adjusting volume, and the like can be performed.

Here, the display portion 7102 includes a display device that can befabricated by using one embodiment of the present invention. Thus, theportable display device can have a curved display portion and highreliability.

FIGS. 24C and 24D each illustrate an example of a lighting device.Lighting devices 7210 and 7220 each include a stage 7201 provided withan operation switch 7203 and a light-emitting portion supported by thestage 7201.

A light-emitting portion 7212 included in the lighting device 7210illustrated in FIG. 24C has two convex-curved light-emitting portionssymmetrically placed. Thus, all directions can be illuminated with thelighting device 7210 as a center.

The lighting device 7220 illustrated in FIG. 24D includes aconcave-curved light-emitting portion 7222. This is suitable forilluminating a specific range because light emitted from thelight-emitting portion 7222 is collected to the front of the lightingdevice 7220.

The light-emitting portion included in each of the lighting devices 7210and 7220 is flexible; thus, the light-emitting portion may be fixed on aplastic member, a movable frame, or the like so that an emission surfaceof the light-emitting portion can be bent freely depending on theintended use.

The light-emitting portions included in the lighting devices 7210 and7220 each include a display device that can be fabricated by using oneembodiment of the present invention. Thus, the lighting devices can havecurved display portions and high reliability.

FIG. 25A illustrates an example of a portable display device. A displaydevice 7300 includes a housing 7301, a display portion 7302, operationbuttons 7303, a display portion pull 7304, and a control portion 7305.

The display device 7300 includes a rolled flexible display portion 7302in the cylindrical housing 7301. The display portion 7302 includes afirst substrate provided with a light-blocking layer and the like and asecond substrate provided with a transistor and the like. The displayportion 7302 is tolled so that the second substrate is positionedagainst an inner wall of the housing 7301.

The display device 7300 can receive a video signal with the controlportion 7305 and can display the received video on the display portion7302. In addition, a battery is included in the control portion 7305.Moreover, a connector may be included in the control portion 7305 sothat a video signal or power can be supplied directly.

With the operation buttons 7303, power ON/OFF, switching of displayedvideos, and the like can be performed.

FIG. 25B illustrates a state in which the display portion 7302 is pulledout with the display portion pull 7304. Videos can be displayed on thedisplay portion 7302 in this state. In addition, the operation buttons7303 on the surface of the housing 7301 allow one-handed operation.

Note that a reinforcement frame may be provided for an edge portion ofthe display portion 7302 in order to prevent the display portion 7302from being curved when pulled out.

Note that in addition to this structure, a speaker may be provided forthe housing so that sound is output with an audio signal receivedtogether with a video signal.

The display portion 7302 includes a display device that can befabricated by using one embodiment of the present invention. Thus, thedisplay portion 7302 is a display device which is flexible and highlyreliable, which makes the display device 7300 lightweight and highlyreliable.

It is needless to say that one embodiment of the present invention isnot limited to the above-described electronic devices and lightingdevices as long as a display device that can be fabricated by using oneembodiment of the present invention is included.

This embodiment can be implemented in an appropriate combination withany of the structures described in the other embodiments.

EXPLANATION OF REFERENCE

11: substrate, 12: separation layer, 3: layer to be separated, 13 s:starting point, 21: substrate, 22: separation layer, 23: layer to beseparated, 25: base, 30: bonding layer, 31: adhesive layer, 32: adhesivelayer, 41: support, 41 b: support, 42: support, 80: processed member, 80a: remaining portion, 80 b: surface, 81: stack, 90: processed member, 90a: remaining portion, 90 b: surface, 91: stack, 91 a: remaining portion,91 b: surface, 91 s: starting point, 92: stack, 100: loader unit. 111:conveying means, 112: conveying means, 200: processed member, 201:processed member, 210: substrate, 211: slit, 212: substrate, 215:flexible substrate, 220: substrate, 230: fixing stage, 231: fixingstage, 240: adsorption mechanism, 241: adsorption jig, 241 a: adsorptionjig, 242: vertical movement mechanism, 243: adsorption portion, 243 a:inlet, 244: axis, 245: movable portion, 250: wedge-shaped jig, 251:needle, 255: sensor, 256: sensor, 260: component, 270: nozzle, 271:nozzle, 280: roller, 281: clamp jig, 291: direction, 292: direction,293: direction, 300: separating unit, 300 b: storage portion, 350:cleaning device, 400: attaching unit, 500: support feeding unit, 600:loader unit, 700: starting point forming unit, 800: separating unit, 800b: storage portion, 850: cleaning unit, 900: attaching unit, 1000:processing apparatus, 1000B: processing apparatus, 1240: adsorptionmechanism, 1241: adsorption jig, 1241 a: adsorption jig, 1241 b:adsorption jig, 1242: vertical movement mechanism, 1243: adsorptionportion, 1243 a: inlet, 1244: axis, 1245: movable portion, 1301: elementlayer, 1303: substrate, 1304: portion, 1305: adhesive layer, 1306:driver circuit portion, 1308: FPC, 1357: conductive layer, 1401:substrate, 1402: substrate, 1403: adhesive layer, 1405: insulatinglayer, 1407: insulating layer, 1408: conductive layer, 1409: insulatinglayer, 1409 a: insulating layer, 1409 b: insulating layer, 1411:insulating layer, 1412: conductive layer, 1413: sealing layer, 1415:connector, 1430: light-emitting element, 1431: lower electrode, 1433: ELlayer, 1433A: EL layer, 1433B: EL layer, 1435: upper electrode, 1440:transistor, 1455: insulating layer, 1457: light-blocking layer, 1459:coloring layer, 1461: insulating layer, 1501: formation substrate, 1503:separation layer, 1505: formation substrate, 1507: separation layer,1510 a: conductive layer, 1510 b: conductive layer, 7100: portabledisplay device, 7101: housing, 7102: display portion, 7103: operationbutton, 7104: sending and receiving device, 7201: stage, 7203: operationswitch, 7210: lighting device, 7212: light-emitting portion, 7220:lighting device, 7222: light-emitting portion, 7300: display device,7301: housing, 7302: display portion, 7303: operation button, 7304:pull, 7305: control portion, 7400: mobile phone, 7401: housing, 7402:display portion, 7403: operation button, 7404: external connection port,7405: speaker, 7406: microphone, and 9999: touch panel.

This application is based on Japanese Patent Application serial no.2013-179217 filed with Japan Patent Office on Aug. 30, 2013; JapanesePatent Application serial no. 2013-179220 filed with Japan Patent Officeon Aug. 30, 2013; Japanese Patent Application serial no. 2014-029422filed with Japan Patent Office on Feb. 19, 2014; and Japanese PatentApplication serial no. 2014-029423 filed with Japan Patent Office onFeb. 19, 2014 the entire contents of which are hereby incorporated byreference.

1. A processing apparatus of a stack including two substrates attachedto each other with a gap provided between and at an end portion of thetwo substrates comprising: a fixing mechanism configured to fix part ofthe stack; a plurality of adsorption jigs configured to fix an outerperipheral edge of one of the substrates of the stack; and awedge-shaped jig configured to be inserted into a corner of the stack,wherein the plurality of adsorption jigs include a mechanism that allowsthe adsorption jigs to move separately in a vertical direction and ahorizontal direction.
 2. The processing apparatus according to claim 1,further comprising a sensor configured to sense a position of the gap.3. The processing apparatus according to claim 1, wherein a tip of thewedge-shaped jig moves along a chamfer formed on an end surface of thestack, and wherein the wedge-shaped jig is inserted into the gap.
 4. Theprocessing apparatus according to claim 1, further comprising a nozzleconfigured to inject liquid to the stack.
 5. The processing apparatusaccording to claim 1, further comprising a roller configured to be incontact with the one of the substrates of the stack.
 6. A processingapparatus of a stack including a flexible substrate comprising: a fixingmechanism configured to fix part of the stack; a plurality of adsorptionjigs configured to fix an outer peripheral edge of the flexiblesubstrate of the stack; and a plurality of clamp jigs configured to fixpart of the flexible substrate of the stack, wherein the plurality ofadsorption jigs and the plurality of clamp jigs each include a mechanismthat allows the plurality of adsorption jigs or the plurality of clampjigs to move separately in a vertical direction and a horizontaldirection.
 7. The processing apparatus according to claim 6, furthercomprising a nozzle configured to inject liquid to the stack.
 8. Theprocessing apparatus according to claim 6, wherein the plurality ofclamp jigs include a first clamp jig and a second clamp jig, and whereinthe first clamp jig and the second clamp jig each include a mechanismthat allows a movement in a direction in which the fixed flexiblesubstrate is expanded.
 9. The processing apparatus according to claim 1,wherein the stack is a first stack, and wherein the fixing mechanism,the plurality of adsorption jigs, and the wedge-shaped jig are includedin a separating unit, the processing apparatus further comprising: aloader unit configured to feed the first stack; a support feeding unitconfigured to feed a support; the separating unit configured to separateone of the substrates of the first stack to form a remaining portion; anattaching unit configured to attach the support to the remaining portionwith the use of an adhesive layer; and an unloader unit configured totransport a second stack including the remaining portion and the supportattached to each other with the adhesive layer.
 10. The processingapparatus according to claim 1, wherein the stack is a first stack, andwherein the fixing mechanism, the plurality of adsorption jigs, and thewedge-shaped jig are included in a first separating unit, the processingapparatus further comprising: a first loader unit configured to feed thefirst stack; a support feeding unit configured to feed a first supportand a second support; the first separating unit configured to separateone of the substrates of the first stack to form a first remainingportion; a first attaching unit configured to attach the first supportto the first remaining portion with the use of a first adhesive layer; afirst unloader unit configured to transport a second stack including thefirst remaining portion and the first support attached to each otherwith the first adhesive layer; a second loader unit configured to feedthe second stack; a starting point forming unit configured to form aseparation starting point in the vicinities of end portions of the firstremaining portion and the first support; a second separating unitconfigured to separate the other of the substrates of the second stackto form a second remaining portion; a second attaching unit configuredto attach the second support to the second remaining portion with theuse of a second adhesive layer; and a second unloader unit configured totransport a third stack including the second remaining portion and thesecond support attached to each other with the second adhesive layer,wherein the second separating unit comprises: a fixing mechanismconfigured to fix the other of the substrates of the second stack; aplurality of adsorption jigs configured to fix an outer peripheral edgeof the first support of the second stack; and a plurality of clamp jigsconfigured to fix part of the first support of the second stack, andwherein the plurality of adsorption jigs and the plurality of clamp jigseach include a mechanism that allows the plurality of adsorption jigs orthe plurality of clamp jigs to move separately in a vertical directionand a horizontal direction.
 11. A method for processing a stackincluding two substrates attached to each other with a gap providedbetween and at an end portion of the two substrates comprising the stepsof: fixing part of the stack to a fixing mechanism; moving a pluralityof adsorption jigs to fix an outer peripheral edge of one of thesubstrates of the stack with the plurality of adsorption jigs; injectinga wedge-shaped jig into a corner of the stack; moving upward theadsorption jig that is closest to the corner among the plurality ofadsorption jigs to start separation of the one of the substrates of thestack; and selectively moving the adsorption jigs sequentially so thatseparated region is increased from a starting point of the separation.12. A method for processing a stack including a flexible substratecomprising the steps of: fixing part of the stack to a fixing mechanism;moving a plurality of adsorption jigs to fix an outer peripheral edge ofthe flexible substrate of the stack with the plurality of adsorptionjigs; moving some of the adsorption jigs to separate part of theflexible substrate of the stack; fixing a plurality of clamp jigs topart of a separated region; and moving the adsorption jigs and the clampjigs to carry on separation of the flexible substrate of the stack.